PBSS5580PA: 80 V,4 A PNP低VCEsat (BISS)晶体管

PNP低VCEsat突破性小信号(BISS)晶体管,采用超薄SOT1061无引脚小型表面贴装器件(SMD)塑料封装,具有中等功率能力。

NPN补充产品:PBSS4580PA。

Outline 3d SOT1061
数据手册 (1)
名称/描述Modified Date
80 V, 4 A PNP low V_CEsat (BISS) transistor (REV 1.0) PDF (167.0 kB) PBSS5580PA [English]18 May 2010
应用说明 (2)
名称/描述Modified Date
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 [English]04 Mar 2013
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
可靠性与质量信息 (1)
名称/描述Modified Date
PBSS5580PA NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5580PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)transistor polarityTransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)RCEsat [max] (mΩ)VCEsat [max] (mV)
PBSS5580PAActiveSOT1061DFN2020-32 x 2 x 0.65PNP12100-80-4-51802657011065105-420
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS5580PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActivePBSS5580PA,115 (9340 639 25115)AFPBSS5580PAAlways Pb-free153.00.711.41E911
80 V, 4 A PNP low V_CEsat (BISS) transistor PBSS5580PA
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS5580PA NXP Product Quality PBSS5580PA
PBSS5580PA SPICE model PBSS5580PA
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
PTVSXU1UPA_SERIES