PCF85063ATL: 具有报警功能和SPI总线的微小封装实时时钟/日历

PCF85063ATL是一款CMOS实时时钟(RTC)和日历,最适合低功耗应用。偏移寄存器允许对时钟进行精细调整。所有地址和数据都可通过两线路双向I²C总线串行传输。最大数据速率为400 kbit/s. 寄存器地址会在每次写入或读取数据字节后自动递增。

Outline 3d SOT1197-1
数据手册 (1)
名称/描述Modified Date
Tiny Real-Time Clock/calendar with alarm function and I2C-bus (REV 6.0) PDF (523.0 kB) PCF85063A [English]18 Nov 2015
应用说明 (1)
名称/描述Modified Date
Improved timekeeping accuracy with PCF85063, PCF8523 and PCF2123 using an external temperature sensor (REV 1.0) PDF (309.0 kB) AN11247 [English]06 Mar 2015
用户指南 (3)
名称/描述Modified Date
User manual for I2C-bus RTC demo board OM11059A (REV 4.0) PDF (447.0 kB) UM10698 [English]05 Nov 2015
User manual for I²C-bus RTC demo board OM13515 (REV 2.0) PDF (436.0 kB) UM10788 [English]05 Oct 2015
User Manual for NXP® Real Time Clocks PCF85x3, PCF85x63, PCA8565, PCF2123, and PCA21125 (REV 2.1) PDF (961.0 kB) UM10301 [English]24 Jul 2015
手册 (1)
名称/描述Modified Date
NXP® RTC PCF85063: Miniaturized, state-of-the-art RTC (REV 1.0) PDF (852.0 kB) 75017502 [English]15 Jan 2014
封装信息 (1)
名称/描述Modified Date
DFN2626-10: plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals (REV 1.0) PDF (191.0 kB) SOT1197-1 [English]08 Feb 2016
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期IFR(FIT)MTBF(小时)MSLMSL LF
PCF85063ATL/1SOT1197-1Reflow_Soldering_ProfileReel 13" Q1/T1ActivePCF85063ATL/1,118 (9352 990 22118)Standard MarkingPCF85063ATL/1Always Pb-free25E811
Tiny Real-Time Clock/calendar with alarm function and I2C-bus PCF85063A
Improved timekeeping accuracy with PCF85063, PCF8523 and PCF2123 using an external temperature sensor PCF85063BTL
User manual for I2C-bus RTC demo board OM11059A PCF85063TP
User manual for I²C-bus RTC demo board OM13515 PCF85063TP
User Manual for NXP® Real Time Clocks PCF85x3, PCF85x63, PCA8565, PCF2123, and PCA21125 pca8565ts
NXP® RTC PCF85063: Miniaturized, state-of-the-art RTC PCF85063BTL
DFN2626-10: plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals PCF85063BTL
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
PCF85063BTL