PESD24VS1ULD: 单向ESD保护二极管

单向静电放电(ESD)保护二极管设计用于保护单条信号线,使其免受ESD和其他瞬态电压导致的损坏。该器件采用超小型无引脚SOD882D表面贴装设备(SMD)塑料封装,具有可见且可焊的侧焊盘。

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数据手册 (1)
名称/描述Modified Date
Unidirectional ESD protection diode (REV 1.0) PDF (292.0 kB) PESD24VS1ULD [English]22 Oct 2010
手册 (2)
名称/描述Modified Date
NXP® SOD882D package, First leadless package with tin-plated, solderable side pads (REV 2.0) PDF (1.8 MB) 75017130 [English]06 Jun 2011
The first leadless package with solderable side pads (REV 1.0) PDF (228.0 kB) POSTER_SOD882D [English]21 Oct 2010
封装信息 (1)
名称/描述Modified Date
DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D [English]08 Feb 2016
可靠性与质量信息 (2)
名称/描述Modified Date
PESD24VS1ULD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD24VS1ULD_1 [English]31 Jan 2015
PESD24VS1ULD NXP Product Quality (REV 1.2) PDF (74.0 kB) PESD24VS1ULD_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD24VS1ULDActiveSOD882DDFN1006D-21 x 0.6 x 0.41Unidirectional235024230.05
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD24VS1ULDSOD882DReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePESD24VS1ULD,315 (9340 649 57315)0010 0000PESD24VS1ULDAlways Pb-free117.00.541.85E911
Unidirectional ESD protection diode pesd24vs1uld
NXP® SOD882D package, First leadless package with tin-plated, solderable side pads pesd5v0s1uld
The first leadless package with solderable side pads pesd5v0s1uld
PESD24VS1ULD NXP® Product Reliability pesd24vs1uld
PESD24VS1ULD NXP Product Quality pesd24vs1uld
PESD24VS1ULD SPICE model PESD24VS1ULD
DFN1006D-2: leadless ultra small plastic package; 2 terminals pesd5v0x1uld
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
BB187LX