PESD3V3L5UK; PESD5V0L5UK: 低电容单向五倍ESD保护二极管阵列的Basic_type_numbers:PESD3V3L5UK、PESD5V0L5UK

低电容单向五倍静电放电(ESD)保护二极管阵列采用超小型无引脚SOT891表面贴装设备(SMD)塑料封装,保护最多5条单向信号线,使其免受ESD和其他瞬态电压导致的损坏。

Outline 3d SOT891
数据手册 (1)
名称/描述Modified Date
Low capacitance unidirectional fivefold ESD protection diode arrays Basic_type_numbers: PESD3V3L5UK; PESD5V0L5UK (REV 1.0) PDF (438.0 kB) PESD3V3L5UK_PESD5V0L5UK [English]31 Aug 2010
封装信息 (1)
名称/描述Modified Date
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT891_132 [English]26 Aug 2014
可靠性与质量信息 (2)
名称/描述Modified Date
PESD3V3L5UK NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L5UK [English]31 Jan 2015
PESD3V3L5UK NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L5UK_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English]03 Jun 2013
SPICE
订购信息
型号状态
PESD3V3L5UKActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD3V3L5UKSOT891Reflow_Soldering_ProfileReel 7" Q1/T1, Q3/T4ActivePESD3V3L5UK,132 (9340 639 76132)P4PESD3V3L5UKAlways Pb-free159.00.741.35E911
Low capacitance unidirectional fivefold ESD protection diode arrays Basic_type_numbers: PESD3V3L5UK; PESD5V0L5UK pesd5v0l5uk
PESD3V3L5UK NXP® Product Reliability pesd3v3l5uk
PESD3V3L5UK NXP® Product Quality pesd3v3l5uk
MAR_SOT891 Topmark prtr5v0u2k
PESD3V3L5UK SPICE model PESD3V3L5UK_PESD5V0L5UK
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm prtr5v0u2k
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
XSON6; reel pack; standard product orientation; 12NC ending 132 prtr5v0u2k
BGU7003