PESD3V3U1UT: 采用SOT23封装的超低电容ESD保护二极管

超低电容静电放电(ESD)保护二极管采用小型SOT23 (TO-236AB) SMD塑料封装,保护单条高速数据线免受ESD和其他瞬态电压导致的损坏。

PESD3V3U1UT: 产品结构框图
PESD3V3U1UT: 应用结构框图
SOT023
数据手册 (1)
名称/描述Modified Date
Ultra low capacitance ESD protection diode in SOT23 package (REV 2.0) PDF (107.0 kB) PESDXU1UT_SER [English]03 Sep 2009
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (1)
名称/描述Modified Date
PESD3V3U1UT NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3U1UT_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD3V3U1UTActiveSOT23TO-236AB2.9 x 1.3 x 11Unidirectional0.61.53.3302
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD3V3U1UTSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActivePESD3V3U1UT,215 (9340 591 01215)%APPESD3V3U1UTAlways Pb-free117.00.541.85E911
Ultra low capacitance ESD protection diode in SOT23 package pesd5v0u1ut
PESD3V3U1UT NXP® Product Quality pesd3v3u1ut
PESD3V3U1UT SPICE model PESDXU1UT_SERIES
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
TL431_FAMILY
PESDXU1UT_SERIES
PMBFJ309