PESD5V0L2UMB: 低电容单向双ESD保护阵列

低电容单向双静电放电(ESD)保护阵列可保护最多两路信号线,使其免受ESD和其他瞬态电压导致的损坏。该器件采用超小型无引脚SOT883B表面贴装设备(SMD)塑料封装。

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数据手册 (1)
名称/描述Modified Date
Low capacitance unidirectional double ESD protection array (REV 1.0) PDF (570.0 kB) PESD5V0L2UMB [English]22 Feb 2012
封装信息 (1)
名称/描述Modified Date
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 [English]22 Jul 2016
可靠性与质量信息 (2)
名称/描述Modified Date
PESD5V0L2UMB NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L2UMB_1 [English]31 Jan 2015
PESD5V0L2UMB NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L2UMB_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD5V0L2UMBActiveSOT883BDFN1006B-31 x 0.6 x 0.372Unidirectional16195150.025
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD5V0L2UMBSOT883BReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePESD5V0L2UMB,315 (9340 658 61315)0001 1011PESD5V0L2UMBAlways Pb-free244.01.138.85E811
Low capacitance unidirectional double ESD protection array PESD5V0L2UMB
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
PESD5V0L2UMB NXP® Product Reliability PESD5V0L2UMB
PESD5V0L2UMB NXP® Product Quality PESD5V0L2UMB
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
PMZB950UPE