PMEG3002AELD: 30 V、0.2 A低V_F MEGA肖特基势垒整流二极管

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用超小型无引脚SOD882D表面贴装设备(SMD)塑料封装,具有可见且可焊的侧焊盘。

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数据手册 (1)
名称/描述Modified Date
30 V, 0.2 A low V_F MEGA Schottky barrier rectifier (REV 1.0) PDF (793.0 kB) PMEG3002AELD [English]20 Apr 2011
应用说明 (1)
名称/描述Modified Date
Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 [English]06 Mar 2015
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D [English]08 Feb 2016
可靠性与质量信息 (2)
名称/描述Modified Date
PMEG3002AELD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3002AELD_1 [English]31 Jan 2015
PMEG3002AELD NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3002AELD_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)Remark
PMEG3002AELDActiveSOD882DDFN1006D-21 x 0.6 x 0.40.230single0,01@VR=10V325@VR=1V480@IF=0,2Asolderable side pads
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG3002AELDSOD882DReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePMEG3002AELD,315 (9340 653 37315)1101 0000PMEG3002AELDAlways Pb-free157.00.731.37E911
30 V, 0.2 A low V_F MEGA Schottky barrier rectifier PMEG3002AELD
Leadless Schottky diodes in a DC-to-DC step-up converter PMEG6020EPA
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG3002AELD NXP® Product Reliability PMEG3002AELD
PMEG3002AELD NXP® Product Quality PMEG3002AELD
PMEG3002AELD SPICE model PMEG3002AELD
DFN1006D-2: leadless ultra small plastic package; 2 terminals pesd5v0x1uld
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
BB187LX