PMEG3010EH_EJ_ET: 1 A very low VF MEGA Schottky barrier rectifiers

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages.

PMEG3010EH_EJ_ET: 产品结构框图
PMEG3010EH_EJ_ET: 应用结构框图
PMEG3010EH_EJ_ET: 应用结构框图
PMEG3010EH_EJ_ET: 应用结构框图
SOT023
数据手册 (1)
名称/描述Modified Date
1 A very low VF MEGA Schottky barrier rectifiers (REV 4.0) PDF (77.0 kB) PMEG3010EH_EJ_ET [English]20 Mar 2007
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (3)
名称/描述Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (172.0 kB) SOD123F [English]08 Feb 2016
plastic surface-mounted package; 2 leads (REV 1.0) PDF (175.0 kB) SOD323F [English]08 Feb 2016
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (3)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD123F_115 [English]07 Nov 2012
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (180.0 kB) SOD323F_115 [English]07 Nov 2012
可靠性与质量信息 (6)
名称/描述Modified Date
PMEG3010EH NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3010EH [English]31 Jan 2015
PMEG3010EH NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3010EH_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PMEG3010EJ NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3010EJ [English]31 Jan 2015
PMEG3010EJ NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3010EJ_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PMEG3010ET NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3010ET [English]31 Jan 2015
PMEG3010ET NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3010ET_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态
PMEG3010EJActive
PMEG3010EHActive
PMEG3010ETActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG3010ETSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActivePMEG3010ET,215 (9340 610 49215)%AVPMEG3010ETAlways Pb-free157.00.731.37E911
PMEG3010EHSOD123FReflow_Soldering_ProfileReel 7" Q1/T1ActivePMEG3010EH,115 (9340 590 31115)AAPMEG3010EHAlways Pb-free157.00.731.37E911
PMEG3010EJSOD323FReflow_Soldering_ProfileReel 7" Q1/T1ActivePMEG3010EJ,115 (9340 585 25115)AKPMEG3010EJAlways Pb-free157.00.731.37E911
1 A very low VF MEGA Schottky barrier rectifiers PMEG3010ET
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG3010EH NXP® Product Reliability PMEG3010EH
PMEG3010EH NXP® Product Quality PMEG3010EH
PMEG3010EJ NXP® Product Reliability PMEG3010EJ
PMEG3010EJ NXP® Product Quality PMEG3010EJ
PMEG3010ET NXP® Product Reliability PMEG3010ET
PMEG3010ET NXP® Product Quality PMEG3010ET
PMEG3010EH SPICE model PMEG3010EH_EJ_ET
PMEG3010EJ SPICE model PMEG3010EJ
PMEG3010ET SPICE model PMEG3010ET
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
plastic surface-mounted package; 2 leads BAT54H
Tape reel; standard product orientation 12NC ending 115 BAT54H
plastic surface-mounted package; 2 leads pesd5v0s1uj
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel; standard product orientation 12NC ending 115 pesd5v0s1uj
TL431_FAMILY
1PSXSB17
1PSXSB17
PMEG4010EH_PMEG4010EJ_PMEG4010ET
PMBFJ309
NZH_SERIES
PESD5V0S1UJ_PESD12VS1UJ