PMEG3015EV: 30 V、1.5 A超低VF MEGA肖特基势垒整流二极管,采用SOT666封装

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用SOT666超小型SMD塑料封装。

PMEG3015EV: 产品结构框图
PMEG3015EV: 应用结构框图
SOT666
数据手册 (1)
名称/描述Modified Date
30 V, 1.5 A ultra low VF MEGA Schottky barrier rectifier in SOT666 package (REV 2.0) PDF (105.0 kB) PMEG3015EV [English]04 Feb 2010
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 [English]29 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PMEG3015EV NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3015EV_1 [English]31 Jan 2015
PMEG3015EV NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3015EV_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)
PMEG3015EVActiveSOT666SOT6661.6 x 1.2 x 0.551.530single1@VR=30V9.572@VR=1V550@IF=1,5A
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG3015EVSOT666Reflow_Soldering_ProfileReel 7" Q1/T1ActivePMEG3015EV,115 (9340 584 27115)1APMEG3015EVAlways Pb-free157.00.731.37E911
30 V, 1.5 A ultra low VF MEGA Schottky barrier rectifier in SOT666 package PMEG3015EV
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG3015EV NXP® Product Reliability PMEG3015EV
PMEG3015EV NXP® Product Quality PMEG3015EV
PMEG3015EV SPICE model PMEG3015EV
plastic surface-mounted package; 6 leads BSS84AKV
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKV
1PSXSB17
PMEGXX10BEA_PMEGXX10BEV
1PSXSB17