PMEG6002EJ: 200 mA低Vf MEGA肖特基势垒整流二极管

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用SOD323F (SC-90)小型扁平引脚表面贴装设备(SMD)塑料封装。

PMEG6002EJ: 产品结构框图
PMEG6002EJ: 应用结构框图
sod323f_3d
数据手册 (1)
名称/描述Modified Date
200 mA low Vf MEGA Schottky barrier rectifier (REV 1.0) PDF (97.0 kB) PMEG6002EJ [English]20 May 2009
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (175.0 kB) SOD323F [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (180.0 kB) SOD323F_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PMEG6002EJ NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG6002EJ_1 [English]31 Jan 2015
PMEG6002EJ NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG6002EJ_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)
PMEG6002EJActiveSOD323FSOD323F1.7 x 1.25 x 0.70.260single0,1@VR=60V2.756@VR=10V600@IF=0,2A
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG6002EJSOD323FReflow_Soldering_ProfileReel 7" Q1/T1ActivePMEG6002EJ,115 (9340 632 41115)1PPMEG6002EJAlways Pb-free157.00.731.37E911
200 mA low Vf MEGA Schottky barrier rectifier PMEG6002EJ
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG6002EJ NXP® Product Reliability PMEG6002EJ
PMEG6002EJ NXP® Product Quality PMEG6002EJ
PMEG6002EJ SPICE model PMEG6002EJ
plastic surface-mounted package; 2 leads pesd5v0s1uj
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel; standard product orientation 12NC ending 115 pesd5v0s1uj
PESD5V0S1UJ_PESD12VS1UJ
1PSXSB17
PESD5V0S1UJ_PESD12VS1UJ