BAS116QA: Low-leakage diode

Single low-leakage current switching diode encapsulated in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

sot1215_3d
数据手册 (1)
名称/描述Modified Date
Low-leakage diode (REV 1.0) PDF (270.0 kB) BAS116QA [English]03 May 2016
封装信息 (1)
名称/描述Modified Date
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English]08 Feb 2016
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)VR max (V)VR [max] (V)IFSM [max] (A)IF max (mA)VF [max] (mV)ConfigurationIR [max] (nA)trr max (ns)IFRM (mA)VFmax (mV)IR max (nA)IFSM max (A)trr [max] (ns)IFRM (mA)IF [max] (mA)Cd max. (pF)Cd [max] (pF)
BAS116QAActiveSOT1215DFN1010D-31.1 x 1.0 x 0.377541000@IF=10mAsingle5@VR=75V70030003002
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAS116QASOT1215Reflow_Soldering_ProfileReel 7" Q2/T3ActiveBAS116QAZ (9340 698 86147)Z 110BAS116QAAlways Pb-free347.01.616.21E811
Low-leakage diode BAS116QA
BAS116QA SPICE model BAS116QA
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE