BAS17: 低压稳定二极管

低压稳压二极管,采用小型SOT23塑料封装。

BAS17: 产品结构框图
SOT023
数据手册 (1)
名称/描述Modified Date
Low-voltage stabistor (REV 3.0) PDF (98.0 kB) BAS17 [English]25 Mar 2003
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BAS17 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS17_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAS17 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAS17_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)PZSM (W)VZ nom (V)ConfigurationVZ max. (V)IF max (mA)VZ min. (V)Tolerance +/-Ptot (mW)
BAS17ActiveSOT23TO-236AB2.9 x 1.3 x 15single200250
BAS17/DGNo Longer ManufacturedSOT23TO-236AB2.9 x 1.3 x 15single200250
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAS17SOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBAS17,215 (9335 262 30215)%A9BAS17week 34, 2003117.00.541.85E911
Low-voltage stabistor BAS17
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
BAS17 NXP Product Quality BAS17
BAS17 NXP® Product Reliability BAS17
BAS17 SPICE model BAS17
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
BAS17
PMBFJ309