BCM856BS; BCM856BS/DG: PNP/PNP匹配双晶体管

PNP/PNP匹配双晶体管,采用小型表面贴装器件(SMD)塑料封装。晶体管在内部完全隔离。

BCM856BS_BCM856BS_DG: 产品结构框图
BCM856BS_BCM856BS_DG: 应用结构框图
SOT363
数据手册 (1)
名称/描述Modified Date
PNP/PNP matched double transistors (REV 1.0) PDF (104.0 kB) BCM856BS_BCM856DS [English]07 Aug 2008
封装信息 (2)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English]08 Feb 2016
包装 (4)
名称/描述Modified Date
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English]30 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]20 Nov 2012
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT363_135 [English]20 Nov 2012
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English]15 Nov 2012
可靠性与质量信息 (4)
名称/描述Modified Date
BCM856BS NXP Product Quality (REV 1.2) PDF (74.0 kB) BCM856BS_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCM856BS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCM856BS_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCM856DS NXP Product Quality (REV 1.2) PDF (74.0 kB) BCM856DS_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCM856DS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCM856DS_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (4)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English]03 Jun 2013
Design Support
SPICE
订购信息
型号状态
BCM856DSActive
BCM856BSActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BCM856BSSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActiveBCM856BSH (9340 620 56125)%BSBCM856BSAlways Pb-free153.00.711.41E911
Reel 7" Q1/T1ActiveBCM856BS,115 (9340 620 56115)%BSBCM856BSAlways Pb-free153.00.711.41E911
Reel 11¼" Q1/T1 in LargePackActiveBCM856BSF (9340 620 56135)%BSBCM856BS153.00.711.41E9
BCM856BS/ZLSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActiveBCM856BS/ZLH (9340 697 92125)Standard MarkingBCM856BS/ZLAlways Pb-free153.00.711.41E911
Reel 7" Q1/T1ActiveBCM856BS/ZLX (9340 697 92115)Standard MarkingBCM856BS/ZLAlways Pb-free153.00.711.41E911
BCM856DSSOT457Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBCM856DS,115 (9340 620 57115)DSBCM856DSAlways Pb-free153.00.711.41E911
PNP/PNP matched double transistors BCM856DS
BCM856BS NXP Product Quality BCM856BS_BCM856BS_DG
BCM856BS NXP® Product Reliability BCM856BS_BCM856BS_DG
BCM856DS NXP Product Quality BCM856DS
BCM856DS NXP® Product Reliability BCM856DS
MAR_SOT363 Topmark BSS84AKS
MAR_SOT457 Topmark 74LVC2G17_Q100
Letter Symbols - Transistors; General PEMD16
BCM856BS SPICE model BCM856BS_BCM856BS_DG
BCM856DS SPICE model BCM856DS
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 pesd5v0l5uy
plastic surface-mounted package; 6 leads BSS84AKS
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
1PS66SB82_1PS88SB82
PBSS5160DS
BFU520Y
SSL5021_SSL5031