BCP51; BCX51; BC51PA: 45 V,1 A PNP中等功率晶体管

PNP中等功率晶体管系列,采用表面贴装器件塑料封装。

SOT089
数据手册 (1)
名称/描述Modified Date
45 V, 1A PNP medium power transistors (REV 9.0) PDF (230.0 kB) BCP51_BCX51_BC51PA [English]24 Oct 2011
应用说明 (1)
名称/描述Modified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]06 Jan 2006
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (3)
名称/描述Modified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English]08 Feb 2016
包装 (5)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English]28 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English]28 Nov 2012
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (18)
名称/描述Modified Date
BC51-10PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC51-10PA [English]31 Jan 2015
BC51-10PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC51-10PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC51-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC51-16PA [English]31 Jan 2015
BC51-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC51-16PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC51PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC51PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC51PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC51PA_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP51-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP51-10_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP51-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP51-10_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP51-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP51-16_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP51-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP51-16_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP51 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP51_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP51 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP51_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCX51-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX51-10_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCX51-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX51-10_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCX51-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX51-16_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCX51-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX51-16_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCX51 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX51_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCX51 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX51_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
软件
订购信息
型号状态
BCP51Active
BC51-16PAActive
BCX51Active
BCX51-16Active
BCX51-10Active
BCP51-10Active
BCP51-16Active
BC51-10PAActive
BC51PAActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC51-16PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC51-16PA,115 (9340 658 16115)BRBC51-16PAAlways Pb-free153.00.711.41E911
BCP51SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBCP51,115 (9339 172 70115)BCP51BCP51week 34, 2003153.00.711.41E911
BCP51-10SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP51-10,135 (9339 172 80135)BCP51/10BCP51-10week 34, 2003153.00.711.41E911
BC51PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC51PA,115 (9340 658 14115)BPBC51PAAlways Pb-free153.00.711.41E911
BCX51-16SOT89Reel 11¼" Q1/T1 in LargePackActiveBCX51-16,135 (9336 747 10135)ADBCX51-16week 28, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCX51-16,115 (9336 747 10115)ADBCX51-16week 28, 2003153.00.711.41E911
BCX51-10SOT89Reel 11¼" Q1/T1 in LargePackActiveBCX51-10F (9336 630 40135)ACBCX51-10Always Pb-free153.00.711.41E911
Reel 7" Q1/T1ActiveBCX51-10,115 (9336 630 40115)ACBCX51-10week 28, 2003153.00.711.41E911
BCX51SOT89Reel 7" Q1/T1ActiveBCX51,115 (9332 722 80115)AABCX51week 28, 2003153.00.711.41E911
BCP51-16SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP51-16,135 (9339 172 90135)BCP51/16BCP51-16week 34, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCP51-16,115 (9339 172 90115)BCP51/16BCP51-16week 34, 2003153.00.711.41E911
BC51-10PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC51-10PA,115 (9340 658 15115)BQBC51-10PAAlways Pb-free153.00.711.41E911
45 V, 1A PNP medium power transistors BCX51-16
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
Medium-power general-purpose transistors BSR43
BC51-10PA NXP® Product Reliability BC51-10PA
BC51-10PA NXP Product Quality BC51-10PA
BC51-16PA NXP® Product Reliability BC51-16PA
BC51-16PA NXP Product Quality BC51-16PA
BC51PA NXP Product Quality BC51PA
BC51PA NXP® Product Reliability BC51PA
BCP51-10 NXP Product Quality BCP51-10
BCP51-10 NXP® Product Reliability BCP51-10
BCP51-16 NXP Product Quality BCP51-16
BCP51-16 NXP® Product Reliability BCP51-16
BCP51 NXP Product Quality BCP51
BCP51 NXP® Product Reliability BCP51
BCX51-10 NXP Product Quality BCX51-10
BCX51-10 NXP® Product Reliability BCX51-10
BCX51-16 NXP Product Quality BCX51-16
BCX51-16 NXP® Product Reliability BCX51-16
BCX51 NXP Product Quality BCX51
BCX51 NXP® Product Reliability BCX51
Letter Symbols - Transistors; General PEMD16
Power Derating Curves for SMDs; General BST62
BC51-10PA SPICE model BCP51_BCX51_BC51PA
BC51-16PA SPICE model BCP51_BCX51_BC51PA
BC51PA SPICE model BCP51_BCX51_BC51PA
BCP51 SPICE model BCP51_BCX51_BC51PA
BCP51-10 SPICE model BCP51-10
BCP51-16 SPICE model BCP51-16
BCX51 SPICE model BCX51
BCX51-10 SPICE model BCX51-10
BCX51-16 SPICE model BCX51-16
BCP51_1_2 BCX51-16
Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
BFU590Q
BLT81
PTVSXU1UPA_SERIES