BCP54; BCX54; BC54PA: 45 V,1 A NPN中等功率晶体管

NPN中等功率晶体管系列,采用表面贴装器件(SMD)塑料封装。

SOT089
数据手册 (1)
名称/描述Modified Date
45 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.1 MB) BCP54_BCX54_BC54PA [English]07 Nov 2011
应用说明 (1)
名称/描述Modified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]06 Jan 2006
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (3)
名称/描述Modified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English]08 Feb 2016
包装 (5)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English]28 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English]28 Nov 2012
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (18)
名称/描述Modified Date
BC54-10PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC54-10PA [English]31 Jan 2015
BC54-10PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC54-10PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC54-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC54-16PA [English]31 Jan 2015
BC54-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC54-16PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC54PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC54PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC54PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC54PA_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP54-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP54-10_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP54-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP54-10_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP54-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP54-16_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP54-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP54-16_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP54 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP54_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP54 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP54_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCX54-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX54-10_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCX54-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX54-10_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCX54-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX54-16_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCX54-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX54-16_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCX54 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX54_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCX54 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX54_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态
BC54PAActive
BCX54-10Active
BCP54Active
BC54-10PAActive
BCX54Active
BCX54-16Active
BC54-16PAActive
BCP54-10Active
BCP54-16Active
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BCX54-10SOT89Reel 7" Q1/T1ActiveBCX54-10,115 (9336 630 70115)BCBCX54-10week 28, 2003153.00.711.41E911
BCX54SOT89Reel 7" Q1/T1ActiveBCX54,115 (9332 723 10115)BABCX54week 28, 2003153.00.711.41E911
BCX54-16SOT89Reel 11¼" Q1/T1 in LargePackActiveBCX54-16,135 (9336 747 40135)BDBCX54-16week 28, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCX54-16,115 (9336 747 40115)BDBCX54-16week 28, 2003153.00.711.41E911
BCP54SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP54,135 (9339 171 80135)BCP54BCP54week 34, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCP54,115 (9339 171 80115)BCP54BCP54week 34, 2003153.00.711.41E911
BC54PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC54PA,115 (9340 657 38115)ATBC54PAAlways Pb-free153.00.711.41E911
BC54-10PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC54-10PA,115 (9340 658 05115)BFBC54-10PAAlways Pb-free153.00.711.41E911
BCP54-16SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP54-16,135 (9339 172 00135)BCP54/16BCP54-16week 34, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCP54-16,115 (9339 172 00115)BCP54/16BCP54-16week 34, 2003153.00.711.41E911
BCP54-10SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP54-10,135 (9339 171 90135)BCP54/10BCP54-10week 34, 2003153.00.711.41E911
BC54-16PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC54-16PA,115 (9340 658 06115)BGBC54-16PAAlways Pb-free153.00.711.41E911
45 V, 1 A NPN medium power transistors BCX54-16
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
Medium-power general-purpose transistors BSR43
BC54-10PA NXP® Product Reliability BC54-10PA
BC54-10PA NXP Product Quality BC54-10PA
BC54-16PA NXP® Product Reliability BC54-16PA
BC54-16PA NXP Product Quality BC54-16PA
BC54PA NXP Product Quality BC54PA
BC54PA NXP® Product Reliability BC54PA
BCP54-10 NXP Product Quality BCP54-10
BCP54-10 NXP® Product Reliability BCP54-10
BCP54-16 NXP Product Quality BCP54-16
BCP54-16 NXP® Product Reliability BCP54-16
BCP54 NXP Product Quality BCP54
BCP54 NXP® Product Reliability BCP54
BCX54-10 NXP Product Quality BCX54-10
BCX54-10 NXP® Product Reliability BCX54-10
BCX54-16 NXP Product Quality BCX54-16
BCX54-16 NXP® Product Reliability BCX54-16
BCX54 NXP Product Quality BCX54
BCX54 NXP® Product Reliability BCX54
Letter Symbols - Transistors; General PEMD16
Power Derating Curves for SMDs; General BST62
BC54-10PA SPICE model BCP54_BCX54_BC54PA
BC54-16PA SPICE model BCP54_BCX54_BC54PA
BC54PA SPICE model BCP54_BCX54_BC54PA
BCP54 SPICE model BCP54_BCX54_BC54PA
BCP54-10 SPICE model BCP54-10
BCP54-16 SPICE model BCP54-16
BCX54 SPICE model BCX54
BCX54-10 SPICE model BCX54-10
BCX54-16 SPICE model BCX54-16
plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
BFU590Q
BLT81
PTVSXU1UPA_SERIES