BCP55; BCX55; BC55PA: 60 V,1 A NPN中等功率晶体管

NPN中等功率晶体管系列,采用表面贴装器件(SMD)塑料封装。

SOT089
数据手册 (1)
名称/描述Modified Date
60 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP55_BCX55_BC55PA [English]10 Nov 2011
应用说明 (1)
名称/描述Modified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]06 Jan 2006
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (3)
名称/描述Modified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English]08 Feb 2016
包装 (5)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English]28 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English]28 Nov 2012
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (18)
名称/描述Modified Date
BC55-10PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55-10PA [English]31 Jan 2015
BC55-10PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55-10PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC55-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55-16PA [English]31 Jan 2015
BC55-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55-16PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC55PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC55PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55PA_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP55-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP55-10_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP55-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP55-10_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP55-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP55-16_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP55-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP55-16_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP55 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP55_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP55 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP55_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCX55-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX55-10_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCX55-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX55-10_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCX55-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX55-16_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCX55-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX55-16_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCX55 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX55_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCX55 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX55_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态
BCP55-16Active
BCX55-16Active
BC55-16PAActive
BCP55-10Active
BCP55Active
BCX55-10Active
BC55-10PAActive
BCX55Active
BC55PAActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC55PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC55PA,115 (9340 657 42115)AWBC55PAAlways Pb-free153.00.711.41E911
BCX55-10SOT89Reel 7" Q1/T1ActiveBCX55-10,115 (9336 630 80115)BGBCX55-10week 28, 2003153.00.711.41E911
BCP55SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP55,135 (9339 172 10135)BCP55BCP55week 34, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCP55,115 (9339 172 10115)BCP55BCP55week 34, 2003153.00.711.41E911
BCP55-10SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBCP55-10,115 (9339 172 20115)BCP55/10BCP55-10week 34, 2003153.00.711.41E911
BCX55SOT89Reel 7" Q1/T1ActiveBCX55,115 (9332 723 20115)BEBCX55week 28, 2003153.00.711.41E911
Reel 11¼" Q1/T1 in LargePackActiveBCX55,135 (9332 723 20135)BEBCX55153.00.711.41E9NANA
BCX55-16SOT89Reel 11¼" Q1/T1 in LargePackActiveBCX55-16,135 (9336 747 50135)BMBCX55-16week 28, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCX55-16,115 (9336 747 50115)BMBCX55-16week 28, 2003153.00.711.41E911
BCP55-16SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP55-16F (9339 172 30135)BCP55/16BCP55-16Always Pb-free153.00.711.41E911
Reel 7" Q1/T1ActiveBCP55-16,115 (9339 172 30115)BCP55/16BCP55-16week 34, 2003153.00.711.41E911
BC55-10PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC55-10PA,115 (9340 658 07115)BHBC55-10PAAlways Pb-free153.00.711.41E911
BC55-16PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC55-16PA,115 (9340 658 08115)BJBC55-16PAAlways Pb-free153.00.711.41E911
60 V, 1 A NPN medium power transistors BCX55-16
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
Medium-power general-purpose transistors BSR43
BC55-10PA NXP® Product Reliability BC55-10PA
BC55-10PA NXP Product Quality BC55-10PA
BC55-16PA NXP® Product Reliability BC55-16PA
BC55-16PA NXP Product Quality BC55-16PA
BC55PA NXP Product Quality BC55PA
BC55PA NXP® Product Reliability BC55PA
BCP55-10 NXP Product Quality BCP55-10
BCP55-10 NXP® Product Reliability BCP55-10
BCP55-16 NXP Product Quality BCP55-16
BCP55-16 NXP® Product Reliability BCP55-16
BCP55 NXP Product Quality BCP55
BCP55 NXP® Product Reliability BCP55
BCX55-10 NXP Product Quality bcx55-10
BCX55-10 NXP® Product Reliability bcx55-10
BCX55-16 NXP Product Quality BCX55-16
BCX55-16 NXP® Product Reliability BCX55-16
BCX55 NXP Product Quality BCX55
BCX55 NXP® Product Reliability BCX55
Letter Symbols - Transistors; General PEMD16
BC55-10PA SPICE model BCP55_BCX55_BC55PA
BC55-16PA SPICE model BCP55_BCX55_BC55PA
BC55PA SPICE model BCP55_BCX55_BC55PA
BCP55 SPICE model BCP55_BCX55_BC55PA
BCP55-10 SPICE model BCP55-10
BCP55-16 SPICE model BCP55-16
BCX55 SPICE model BCX55
BCX55-10 SPICE model BCX55-10
BCX55-16 SPICE model BCX55-16
plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
BFU590Q
BLT81
PTVSXU1UPA_SERIES