BGA2818:MMIC宽带放大器

硅单片微波集成电路(MMIC)宽带放大器,具有内部匹配电路,采用6针SOT363塑料SMD封装。

特性和优势
    • 内部匹配至50 Ω
    • 2150 MHz时30.0 dB的增益
    • 1 dB增益压缩点处的输出功率 = 4 dBm(2150 MHz时)
    • 电源电流 = 19.9 mA(电源电压为3.3 V时)
    • 反向隔离度 > 36 dB(高达2150 MHz时)
    • 因二阶乘积和三阶乘积低而达到的良好线性度
    • 噪声系数 = 3.3 dB(950 MHz时)
    • 无条件稳定(K > 1)
    • 无需输出电感
应用
    • LNB中频放大器
    • 适用于频率范围在直流和2.2 GHz之间的通用低噪声宽带放大器
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
VCCsupply voltageRF input AC coupled-0.55V
ICCsupply current55mA
Ptottotal power dissipationTsp = 90 °C200mW
Gppower gainf = 250 MHz; VSUP = 3.3 V29.530.130.7dB
Gppower gainf = 950 MHz; VSUP = 3.3 V29.129.830.6dB
Gppower gainf = 2150 MHz; VSUP = 3.3 V28.53031.4dB
PL(1dB)output power at 1 dB gain compressionISUP = 22.2 mA; f = 950 MHz; VSUP = 3.3 V567dBm
NFnoise figuref = 950 MHz2.93.33.8dB
IP3ooutput output third-order intercept pointf2 = 951 MHz; f1 = 950 MHz; Pdrive = -43 dBm (for each tone)1518dBm
PL(sat)saturated output powerf = 950 MHz78dBm
PL(sat)saturated output powerf = 2150 MHz56dBm
B-3dB-3 dB bandwidth3 dB below gain at 1 GHz; VSUP = 3.3 V; ISUP = 20 mA2.72.93.1GHz
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BGA2818
TSSOP6
(SOT363)
sot363_posot363_fr
sot363_fw
Reel 7" Q1/T1量产TA%BGA2818,115( 9352 940 08115 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1VCCsupply voltage
2GND2ground 2
3RF_OUTRF output
4GND1ground 1
5GND2ground 2
6RF_INRF input
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BGA2818BGA2818,115Always Pb-free11
文档资料
档案名称标题类型格式日期
BGA2818 (中文)MMIC wideband amplifierData sheetpdf2015-06-08
75017501Design with confidence using our latest RF discreteLeafletpdf2014-01-07
sot363_fwFootprint for wave soldering SOT363Wave solderingpdf2009-10-08
sot363_poplastic surface-mounted package; 6 leadsOutline drawingpdf2009-10-08
sot363_frFootprint for reflow soldering SOT363Reflow solderingpdf2010-07-13
SOT363_115TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115Packingpdf2012-11-15
MAR_SOT363MAR_SOT363 TopmarkTop Markingpdf2013-06-03
Reflow_Soldering_ProfileReflow Soldering ProfileReflow solderingpdf2013-09-30
Wave_Soldering_ProfileWave Soldering ProfileWave solderingpdf2013-09-30
订购信息
型号订购码 (12NC)可订购的器件编号
BGA28189352 940 08115BGA2818,115
MMIC wideband amplifier bga2818
Design with confidence using our latest RF discrete bfu590q
Footprint for wave soldering SOT363 BFU520Y
plastic surface-mounted package; 6 leads BFU520Y
Footprint for reflow soldering SOT363 BFU520Y
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
MAR_SOT363 Topmark BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20