BGS8324: WLAN LNA + switch

The BGS8324 is a fully integrated MMIC Low Noise Amplifier (LNA) and SP3T switch (SW) for Bluetooth path and transmit path for WLAN applications in the 2.4 GHz to 2.5 GHz ISM band. Manufactured using NXP®'s high performance QUBiC eighth generation SiGe:C technology, the BGS8324 couples best-in-class noise figure, linearity and efficiency and low insertion loss CMOS switches with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGS8324 has a 2.0 mm x 2.0 mm footprint HX2QFN12 package (Heat sink eXtremely thin, 2nd generation, Quad Flat No lead, 12 terminals) and a thickness of 300 µm.

sot1261-1_3d
数据手册 (1)
名称/描述Modified Date
WLAN LNA + Switch (REV 2.0) PDF (137.0 kB) BGS8324 [English]22 Jun 2016
封装信息 (1)
名称/描述Modified Date
plastic, thermal enhanced super thin quad flat package; no leads;12 terminals; body 2.0 x 2.0 x 0.3 mm (REV 1.2) PDF (212.0 kB) SOT1261-1 [English]28 Jun 2016
包装 (1)
名称/描述Modified Date
HX2QFN12; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or... (REV 2.0) PDF (189.0 kB) SOT1261-1_147 [English]28 Oct 2016
订购信息
型号状态Package version@VCC [min] (V)@VCC [max] (V)@ICC [typ] (mA)Gp [typ] (dB)NF [typ] (dB)Pi(1dB) [min] (dBm)Pi(1dB) [typ] (dBm)IP3i [min] (dBm)IP3i [typ] (dBm)@VCC (V)@f (MHz)
BGS8324ActiveSOT1261-12.75.25162-6.000000000000001
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
BGS8324SOT1261-1Reel 7" Q2/T3ActiveBGS8324Z (9340 689 36147)Standard MarkingBGS8324Always Pb-free11
WLAN LNA + Switch BGS8324
plastic, thermal enhanced super thin quad flat package; no leads;12 terminals; body 2.0 x 2.0 x 0.3 mm BGS8324
HX2QFN12; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or... BGS8324