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MSC8126: Quad Core 16-bit DSP with Ethernet, TCOP and VCOP

The MSC8126 is a highly integrated system-on-a-chip that combines four StarCore® SC140 extended cores with an RS-232 serial interface, four time-division multiplexed (TDM) serial interfaces, thirty-two general-purpose timers, a flexible system interface unit (SIU), an Ethernet interface, a Turbo Coprocessor (TCOP), a Viterbi Coprocessor (VCOP), and a multi-channel DMA controller. The four extended cores can deliver up to 8000 DSP MMACS performance at up to 500 MHz.

Each core has four arithmetic logic units (ALUs), internal memory, a write buffer, and two interrupt controllers. The MSC8126 targets high-bandwidth highly computational DSP applications and is optimized for wireless transcoding and packet telephony as well as high-bandwidth base station applications. The MSC8126 delivers enhanced performance while maintaining low power dissipation and greatly reduces system cost.

The MSC8126 device is designed to provide an optimal solution for 3G wireless base stations, to help eliminate many of the costly and power hungry ASICs and FPGAs required in today's systems for both symbol rate and for chip rate assist. In addition, the MSC8126 device allows customers to add next-generation features that efficiently use available frequencies and higher bit rates in 3G systems.

Efficient application software development is key in Our strategy to expedite customers' time to market. Developers can take advantage of development tools and real-time operating systems (RTOS) from NXP® and third-party suppliers. In addition NXP is partnering with third-party vendors to provide integrated systems solutions that include GSM, CDMA, TDMA, and ITU G.7xx speech coders, hybrid echo cancellation, fax, modem, and xDSL software.

Quad Core 16-bit DSP MSC8126 Block Diagram

Four 400/500 MHz StarCore® SC140 DSP extended cores

• 16 ALUs on a chip deliver up to 6400/8000 MMACS
• Performance equivalent to a 1.6/2.0 GHz SC140 Core

The MSC8126 device is manufactured in 90 nm process technology. The device uses a 20 mm x 20 mm Flip Chip Ball-Grid Array (FC-BGA) package, available with lead-free or lead-bearing spheres.

Availability

Contact your local Sales office for information about availability.

Data Sheets (1)

Errata (2)

Application Notes (72)

Reference Manuals (5)

Product Briefs (1)

Engineering Bulletins (2)

Fact Sheets (6)

Selector Guides (3)

Product Change Notices (1)

Product Numbering Scheme (1)

订购信息

封装环保信息

Package Description	Outline Version	Packing	Product Status	Part Number	Chemical Content	RoHS / Pb FreeChina RoHS Lookup	MSL	PPT (°C)
FCPBGA 431 20*20*3.8P0.8	98ARE10549D	MPQ - 60 TRAYPOQ - 300 BOX	No Longer Manufactured	MSC8126TMP6400	MSC8126TMP6400.pdf	ROHS = No   Pb-free = No ROHS = No   Pb-free = No	3	250
			No Longer Manufactured	MSC8126VT8000	MSC8126VT8000.pdf		3	250
			No Longer Manufactured	MSC8126MP8000	MSC8126MP8000.pdf	ROHS = No   Pb-free = No ROHS = No   Pb-free = No	3	250
			No Longer Manufactured	MSC8126TVT6400	MSC8126TVT6400.pdf		3	250
			No Longer Manufactured	KMSC8126MP8000	KMSC8126MP8000.pdf	ROHS = No   Pb-free = No ROHS = No   Pb-free = No	3	250
			No Longer Manufactured	KMSC8126TMP6400	KMSC8126TMP6400.pdf	ROHS = No   Pb-free = No ROHS = No   Pb-free = No	3	250
			No Longer Manufactured	KMSC8126TVT6400	KMSC8126TVT6400.pdf		3	250
			No Longer Manufactured	KMSC8126VT8000	KMSC8126VT8000.pdf		3	250