PMEG2020EPA: 2 A低V_F MEGA肖特基势垒整流二极管

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用SOT1061小型无引脚表面贴装设备(SMD)塑料封装。

Outline 3d SOT1061
数据手册 (1)
名称/描述Modified Date
2 A low V_F MEGA Schottky barrier rectifier (REV 1.0) PDF (263.0 kB) PMEG2020EPA [English]10 Feb 2010
应用说明 (1)
名称/描述Modified Date
Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 [English]06 Mar 2015
手册 (1)
名称/描述Modified Date
1 and 2 A Schottky rectifiers in leadless medium-power package; NXP® low VF (MEGA) Schottky rectifier... (REV 1.0) PDF (2.6 MB) 75017425 [English]20 Apr 2013
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PMEG2020EPA NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG2020EPA_1 [English]31 Jan 2015
PMEG2020EPA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG2020EPA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)
PMEG2020EPAActiveSOT1061DFN2020-32 x 2 x 0.65220single1,9@VR=20V1765@VR=10V420@IF=2A
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG2020EPASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActivePMEG2020EPA,115 (9340 642 95115)AKPMEG2020EPAAlways Pb-free157.00.731.37E911
2 A low V_F MEGA Schottky barrier rectifier PMEG2020EPA
Leadless Schottky diodes in a DC-to-DC step-up converter PMEG6020EPA
1 and 2 A Schottky rectifiers in leadless medium-power package; NXP® low VF (MEGA) Schottky rectifier... PMEG6020EPA
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG2020EPA NXP® Product Reliability PMEG2020EPA
PMEG2020EPA NXP® Product Quality PMEG2020EPA
PMEG2020EPA SPICE model PMEG2020EPA
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
PTVSXU1UPA_SERIES