RB521S30: 200 mA低Vf MEGA肖特基势垒整流器

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用SOD523 (SC-79)超小型扁平引脚表面贴装器件(SMD)塑料封装。

RB521S30: 产品结构框图
RB521S30: 应用结构框图
sod523_3d
数据手册 (1)
名称/描述Modified Date
200 mA low Vf MEGA Schottky barrier rectifier (REV 1.0) PDF (236.0 kB) RB521S30 [English]08 Oct 2009
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
RB521S30 NXP Product Quality (REV 1.2) PDF (74.0 kB) RB521S30_NXP_PRODUCT_QUALITY [English]31 Jan 2015
RB521S30 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB521S30_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)IR [max] (µA)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)VR [max] (V)IF [max] (mA)VR (V)
RB521S30ActiveSOD523SOD5231.2 x 0.8 x 0.610@VR=10Vsingle500@IF=200mA125@VR=1V0.03@VR=10V30200
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
RB521S30SOD523Reflow_Soldering_ProfileReel 7" Q1/T1ActiveRB521S30,115 (9340 639 55115)ZBRB521S30Always Pb-free157.00.731.37E911
200 mA low Vf MEGA Schottky barrier rectifier RB521S30
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
RB521S30 NXP Product Quality RB521S30
RB521S30 NXP® Product Reliability RB521S30
RB521S30 SPICE model RB521S30
plastic surface-mounted package; 2 leads pesd5z7.0
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel; standard product orientation 12NC ending 115 pesd5z7.0
1PSXSB17
BB208-02