CSD Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom)

技术特性
  • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
  • Monolithic construction
  • Ceramic package with no cavity. 4 pins to 20 pins.
Datasheet
Approval Documents
General Information
Lead Free
Ordering Info
Product Literature
  • Capabilities - Thin Film Resistor Networks - Precision Thin Film Technology
  • Product Sheet - Quick-Net® Thin Film Precision Resistor Networks
CSD 60046
Certificate 60013
Certification 60033
Land Patterns 60013
Lead-Free Family Summary Sheet - Resistor Components 60013
Ordering Info 60047
Capabilities 60013
Product Sheet 60013
CSD Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom) 60046