CSOM Sandwich, 25 mil Pitch, Dual In-Line Thin Film Resistor, Surface Mount Network

技术特性
  • Lead (Pb)-free gold plated terminals standard
  • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
  • Tighter tolerances than molded standards (0.01 %)
Datasheet
CSOM 60121
CSOM Sandwich, 25 mil Pitch, Dual In-Line Thin Film Resistor, Surface Mount Network 60121