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SQD50P03-07 Automotive P-Channel 30 V (D-S) 175 °C MOSFET

技术特性

• TrenchFET® Power MOSFET
• AEC-Q101 Qualifiedd
• 100 % Rg and UIS Tested

Datasheet

• SQD50P03-07

Markings

• Part Marking Information - TO-252 (DPAK), TO251

Ordering Info

• Ordering Information - DPAK / TO-252 and Reverse DPAK

Package Drawings

• Package Information - TO-252AA Case Outline

Pad Guidelines

• Application Note 826 - RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)

RC Thermal Models

• SQD50P03-07_RC - R-C Thermal Model Parameters
• SQJ912AEP_RC - R-C Thermal Model Parameters

Reel Info

• Reel Information - Reel

Reliability Data

• Package Reliability - Environmental and Package Testing Data for DPAK (TO-252)
• Silicon Technology Reliability - P-Channel - Automotive Accelerated Operating Life Test Result

Tape Info

• 90-2339-1 - Tape Drawing for TO-252 (DPAK) (T1 Method)
• 90-2369-x - Tape Drawing for TO-252 (DPAK) (T4 Method)
• PACK-0020- - Device Orientation for TO-252 and Reverse TO-252 (T4)
• PACK-0020- - Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1)

SPICE Models (*.pdf)

• SQD50P03-07-DS - DS-SPICE Model for SQD50P03-07
• SQS482EN-DS - DS-SPICE Model for SQS482EN

SPICE Models (*.zip)

• SQD50P03-07-zip - SPICE Models for SQD50P03-07
• SQS482EN-zip - SPICE Models for SQS482EN