数据手册DataSheet 下载

• BY228GP

Application Notes

• Application Note - Design Guidelines for Schottky Rectifiers
• Application Note - Fundamentals of Rectifiers
• Application Note - High Speed Data Line Protection - Low Current Bridges Rectifiers Lend Themselves to Data Line Protection
• Application Note - Physical Explanation
• Application Note - Power Factor Correction with Ultrafast Diodes
• Application Note - Rectifiers for Power-Factor-Correction (PFC)
• Application Note - SUPERRECTIFIER Design Brings New Level of Reliability to Surface Mount Components
• Application Note - Using Rectifiers in Voltage Multiplier Circuits

Markings

• PDD Marking - PDD Marking

Packaging Information

• Packaging Information - Packaging Information

Reference Data

• Pad Layouts/Soldering Process - Vishay General Semiconductor Recommended Minimum Mounting Pad Layout Sizes For The Surface Mount Rectifier

SPICE 3 Models (*.txt)

• BY228GP - SPICE3

BY228GP 88539

Application Note - Design Guidelines for Schottky Rectifiers diodes_rectifiers_ultrafast-recovery_smb-do213ab

Application Note - Fundamentals of Rectifiers diodes_rectifiers_ultrafast-recovery_smb-do213ab

Application Note 88755

Application Note - Power Factor Correction with Ultrafast Diodes diodes_rectifiers_ultrafast-recovery_smb-do213ab

Application Note 88755

Application Note 88755

Application Note 88755

PDD Marking - PDD Marking diodes_rectifiers_ultrafast-recovery_smb-do213ab

Packaging Information 30205

Pad Layouts/Soldering Process 88986

BY228GP - SPICE3 88539