BYG23M Ultrafast Avalanche SMD Rectifier

技术特性
  • Low profile package
  • Ideal for automated placement
  • Glass passivated pellet chip junction
Datasheet
Application Notes
Markings
Packaging Information
Product Literature
SPICE 3 Models (*.txt)
BYG23M 89477
Application Note 88755
Application Note 88755
Application Note 88755
Application Note 88755
Application Note 88755
Application Note 88755
Application Note 88755
Diodes Group Body Marking 89174
Packaging Information 30205
Selector Guide 86061
BYG23M 88962
BYG23M Ultrafast Avalanche SMD Rectifier 88962