HMC363S8G InGaP HBT Divide-by-8 SMT, DC - 12 GHz

The HMC363S8G(E) is a low noise Divide-by-8 Static Divider with InGaP GaAs HBT technology in an 8 lead surface mount plastic package. This device operates from DC (with a square wave input) to 12 GHz input frequency with a single +5V DC supply. The low additive SSB phase noise of -153 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance.

Applications
  • Satellite Communication Systems
  • Fiber Optic
  • Point-to-Point
  • Point-to-Multi-Point Radios
  • VSAT
Features and Benefits
  • Ultra Low SSB Phase Noise:
    -153 dBc/Hz
  • Wide Bandwidth
  • Output Power: -6 dBm
  • Single DC Supply: +5V
  • S8G SMT Package
RF & Microwave
Data Sheets
Documentnote
HMC363S8G Data SheetPDF 728.95 K
Order Information
Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
HMC363S8G Production8 ld SOIC_EPOTH 50-40 to 85C14.5911.81N
HMC363S8GE Production8 ld SOIC_EPOTH 50-40 to 85C11.679.45Y
HMC363S8GETR Production8 ld SOIC_EPREEL 500-40 to 85C11.679.45Y
HMC363S8GTR Production8 ld SOIC_EPREEL 500-40 to 85C14.5911.81N
Evaluation Boards
Part NumberDescriptionPriceRoHS
104631-HMC363S8GEvaluation Board - HMC363S8G Evaluation PCB293.07Y
Reference Materials
HMC363S8G Data Sheet hmc363s8g
Semiconductor Qualification Test Report: GaAs HBT-A (QTR: 2013-00228) hmc587
Package/Assembly Qualification Test Report: Plastic Encapsulated SOIC (QTR:... hmc754
PCN: MS, QS, SOT, SOIC packages - Sn/Pb plating vendor change hmc536ms8g
HMC Legacy PCN: S## and S##E packages - Relocation of pre-existing... hmc754
SOIC 8 Tape Specification (S8, S8G) hmc754