HMC365-Die InGaP HBT Divide-by-4 Chip, DC - 13 GHz

The HMC365 is a low noise Divide-by-4 Static Divider with InGaP GaAs HBT technology that has a small size of 1.30 x 0.69 mm. This device operates from DC (with a square wave input) to 13 GHz input frequency with a single +5V DC supply. The low additive SSB phase noise of -151 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance.

Applications
  • Satellite Communication Systems
  • Fiber Optic
  • Piont-to-Point Radios
  • Point-to-Multi-Point Radios
  • VSAT
Features and Benefits
  • Ultra Low SSB Phase Noise:
    -151 dBc/Hz
  • Wide Bandwidth
  • Output Power: 5 dBm
  • Single DC Supply: +5V
  • Small Size: 1.30 x 0.69 x 0.1 mm
RF & Microwave
Data Sheets
Documentnote
HMC365 Die Data SheetPDF 548.53 K
Order Information
Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
HMC365 ProductionCHIPS OR DIEREEL 50-40 to 85C20.5116.61Y
HMC365-SX ProductionCHIPS OR DIEREEL 2-40 to 85C00Y
Reference Materials
HMC365 Die Data Sheet hmc365-die
Semiconductor Qualification Test Report: GaAs HBT-A (QTR: 2013-00228) hmc587