HMC493 InGaP HBT Divide-by-4 SMT, DC - 18 GHz

The HMC493LP3(E) is a low noise Divide-by-4 Static Divider utilizing InGaP GaAs HBT technology packaged in leadless 3x3 mm QFN surface mount plastic package. This device operates from DC (with a square wave input) to 18 GHz input frequency from a single +5.0V DC supply. The low additive SSB phase noise of -150 dBc/Hz at 100 kHz offset helps the user maintain excellent system noise performance.

Applications

Features and Benefits
  • Ultra Low SSB Phase Noise: -150 dBc/Hz
  • Very Wide Bandwidth
  • Output Power: -4 dBm
  • Single DC Supply: +5V
  • 3x3 mm QFN SMT Package
RF & Microwave
Data Sheets
Documentnote
HMC493 Data SheetPDF 584.7 K
Order Information
Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
HMC493LP3 Production16 ld QFN (3x3mm w/1.7mm ep)OTH 50-40 to 85C15.7212.73N
HMC493LP3E Production16 ld QFN (3x3mm w/1.7mm ep)OTH 50-40 to 85C15.4912.54Y
HMC493LP3ETR Production16 ld QFN (3x3mm w/1.7mm ep)REEL 500-40 to 85C15.4912.54Y
HMC493LP3TR Production16 ld QFN (3x3mm w/1.7mm ep)REEL 500-40 to 85C15.7212.73N
Evaluation Boards
Part NumberDescriptionPriceRoHS
107384-HMC493LP3Evaluation Board - HMC493LP3 Evaluation PCB319.7Y
Reference Materials
HMC493 Data Sheet hmc493
Semiconductor Qualification Test Report: GaAs HBT-A (QTR: 2013-00228) hmc587
Package/Assembly Qualification Test Report: LP2, LP2C, LP3, LP3B, LP3C,... hmc344
Package/Assembly Qualification Test Report: 16L 3x3mm QFN Package (QTR:... hmc344
Package/Assembly Qualification Test Report: Plastic Encapsulated QFN (QTR:... hmc344
LP3, LC3, LC3B Tape and Reel Outline Dimensions hmc344