DF200R12W1H3_B27

Fast and solder-less assembly is possible using our  EasyPACK 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.

ParametricDF200R12W1H3_B27
ConfigurationBooster with NTC
IC(nom) / IF(nom)200.0A
VCE(sat) (Tvj=25°C typ)1.3V
VF (Tvj=25°C typ)2.0V
HousingEasyPACK 1B
Sales Product NameDF200R12W1H3_B27
OPNDF200R12W1H3B27BOMA1
Product Statusactive
Package NameAG-EASY1B-2
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size24
Packing TypeTRAY
Summary of Features:
  • High Speed IGBT H3
  • Low Switching Losses
  • Fast Silicon diode 1200V
  • Al(2)O(3) Substrate with Low Thermal Resistance
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
DF200R12W1H3_B27 (german/english),EN/DE,EN/CN,EN/JA747 KB15 Apr 201402_00
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demandsEN1.3 MB27 Apr 201608_00
1EDI EiceDRIVER™ Compact 300 milEN216 KB09 May 201601_00
Product Brochure Industrial Gate Driver ICs OverviewEN613 KB27 Apr 201603_00
Application Notes
TitleSizeDateVersion
Driving IGBTs with unipolar gate voltageENCN389 KB10 Feb 2014
Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 Dec 201501_02
Thermal equivalent circuit models (english version)ENDECN295 KB20 Jun 2008
Application Note IGBT Definition of Junction TemperatureEN84 KB09 Apr 2009
Deadtime calculation for IGBT ModulesENCN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 Feb 2014
Series connection of IGBTsEN28 KB10 Feb 2014
Paralleling of IGBTsEN28 KB10 Feb 2014
Using the NTC inside a power moduleENCN295 KB13 Jan 2010
Assembly Instructions - Easy-PressFIT ModulesEN1.5 MB29 Apr 201302_02
Product Brief
TitleSizeDateVersion
Easy & Econo Power ModulesENCN433 KB27 Apr 201608_00
Easy B-series and Easy750 Power modulesENCN165 KB27 Apr 201607_00
PressFIT - Our established, reliable mounting technologyEN616 KB27 Apr 201608_00
Modules for Photo Voltaic String and Multi-String InvertersEN476 KB27 Apr 201604_00
Editorials
TitleSizeDateVersion
Thermal Heat Sink Interface of IGBT Modules w/o Base PlateEN384 KB07 Feb 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 Nov 201501_00
Reliability of PressFIT connectionsEN472 KB06 Jun 2008
PressFIT Technology, a Solderless Method for Mounting Power ModulesEN377 KB12 Feb 2014
The challenge of accurately analyzing thermal resistancesEN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial DrivesEN2.4 MB27 Apr 201609_00
Solutions for Solar Energy SystemsEN1.9 MB26 Jun 201401_00
Solutions for Uninterruptible Power Supply (UPS) SystemsEN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy1-BEN38 KB06 Jan 201403_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIMEN3.4 MB18 Mar 2014
EN/CN DF200R12W1H3_B27
EN/DE DF200R12W1H3_B27
EN/JA DF200R12W1H3_B27
EN 2EDN7524G
EN 1EDI60I12AH
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FS50R07W1E3_B11A
CN F3L030E07-F-W2
EN F3L030E07-F-W2
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN TDB6HK180N16RR_B11
EN sic-modules
EN FS10R12VT3
EN DD250S65K3
EN FS100R17N3E4_B11
EN FS100R17N3E4_B11
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IDW40E65D2
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN DDB6U75N16W1R_B11
EN IFS75B12N3E4_B32