F3L100R07W2E3_B11

EasyPACK 2B 650V 3-level phase leg IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode, NTC and PressFIT Contact Technology

ParametricF3L100R07W2E3_B11
Configuration3-level
IC(nom) / IF(nom)100.0A
VCE(sat) (Tvj=25°C typ)1.45V
VF (Tvj=25°C typ)1.55V
HousingEasyPACK 2B
Sales Product NameF3L100R07W2E3_B11
OPNF3L100R07W2E3B11BOMA1
Product Statusactive and preferred
Package NameAG-EASY2B-2
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size15
Packing TypeTRAY
Summary of Features:
  • Increased blocking voltage capability to 650V
  • Low inductive design
  • Low Switching Losses
  • Low V(CEsat)
  • Al(2)O(3) Substrate with Low Thermal Resistance
  • Compact Design
  • PressFIT Contact Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
F3L100R07W2E3_B11 (german/english),EN/DE,EN/CN,EN/JA820 KB02 Dec 201302_01
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 milEN216 KB09 May 201601_00
Best-in-class products to meet your application demandsEN1.3 MB27 Apr 201608_00
Product Brochure Industrial Gate Driver ICs OverviewEN613 KB27 Apr 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltageENCN389 KB10 Feb 2014
Using the NTC inside a power moduleENCN295 KB13 Jan 2010
Application Note IGBT Definition of Junction TemperatureEN84 KB09 Apr 2009
Assembly Instructions - Easy-PressFIT ModulesEN1.5 MB29 Apr 201302_02
Evaluation Board for Easy2B 3-Level ModulesEN1.6 MB14 Dec 2010
Characteristic differences between 1200V IGBT3 modules of E3 and T3 seriesENCN252 KB10 Feb 2014
Thermal equivalent circuit models (english version)ENDECN295 KB20 Jun 2008
Deadtime calculation for IGBT ModulesENCN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 Feb 2014
Series connection of IGBTsEN28 KB10 Feb 2014
Paralleling of IGBTsEN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Easy & Econo Power ModulesENCN433 KB27 Apr 201608_00
Easy B-series and Easy750 Power modulesENCN165 KB27 Apr 201607_00
PressFIT - Our established, reliable mounting technologyEN616 KB27 Apr 201608_00
Modules for Photo Voltaic String and Multi-String InvertersEN476 KB27 Apr 201604_00
3-Level Inverter ModulesEN307 KB27 Apr 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 Nov 201501_00
IGBT power modules utilizing new 650V IGBT3 and Emitter Controlled Diode3 chips for three level converterEN325 KB31 Jan 2011
Reliability of PressFIT connectionsEN472 KB06 Jun 2008
Thermal Heat Sink Interface of IGBT Modules w/o Base PlateEN384 KB07 Feb 2014
PressFIT Technology, a Solderless Method for Mounting Power ModulesEN377 KB12 Feb 2014
Impact of module parasitics on the performance of fast-switching devicesEN3.7 MB31 May 2014
The challenge of accurately analyzing thermal resistancesEN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Solar Energy SystemsEN1.9 MB26 Jun 201401_00
Solutions for Industrial DrivesEN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) SystemsEN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy2-BEN78 KB06 Feb 201503_01
Evaluation Boards
BoardFamilyDescriptionStatus
7ED020E12-FI-W2IGBT ModulesEvaluation Driver Board for EasyPIM™ 2B PressFIT Modules up to 1200V. Coreless transformer halfbridge IGBT drivers (2ED020I12-FI) are used for gate control and protection.Equipped with EiceDRIVER™ 2ED020I12-FIFor driving EasyPIM™ 2B PressFIT Moduleson request
F3L030E07-F-W2IGBT ModulesEvaluation Driver board for 650V Easy2B 3-level modules in NPC1-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.Equipped with EiceDRIVER™ 1ED020I12-F2For driving Easy2B 3-level Moduleson request
Simulation Models
TitleSizeDateVersion
IPOSIMEN3.4 MB18 Mar 2014
EN/CN F3L100R07W2E3_B11
EN/DE F3L100R07W2E3_B11
EN/JA F3L100R07W2E3_B11
EN 2EDN7524G
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FS50R07W1E3_B11A
EN F3L030E07-F-W2
CN FZ250R65KE3
EN FZ250R65KE3
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN TDB6HK180N16RR_B11
EN sic-modules
EN F3L2020E12-F-P_EVAL
EN DD250S65K3
EN F3L75R07W2E3_B11
EN FS100R17N3E4_B11
EN FS10R12VT3
EN FS100R17N3E4_B11
EN FS3L25R12W2H3_B11
EN DD250S65K3
EN IDW40E65D2
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FS75R07W2E3_B11A
EN IFS75B12N3E4_B32