FS150R17N3E4

EconoPACK™ 3 1200V sixpack IGBT module with fast Trench/Fieldstop IGBT4, Emitter Controlled Diode and NTC

ParametricFS150R17N3E4
ConfigurationSixpack
IC(nom) / IF(nom)150.0A
VCE(sat) (Tvj=25°C typ)1.95V
VF (Tvj=25°C typ)1.8V
HousingEconoPACK™ 3
Sales Product NameFS150R17N3E4
OPNFS150R17N3E4BOSA1
Product Statusactive and preferred
Package NameAG-ECONO3-4
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Extended Operation Temperature Tvj op
  • Low V(CEsat)
  • V(CEsat) with positive Temperature Coefficient
  • Integrated NTC temperature sensor
  • Isolated Base Plate
  • Solder Contact Technology
  • Standard Housing
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
FS150R17N3E4,EN/DE,EN/CN,EN/JA688 KB10 Dec 201302_00
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs OverviewEN613 KB27 Apr 201603_00
Best-in-class products to meet your application demandsEN1.3 MB27 Apr 201608_00
Application Notes
TitleSizeDateVersion
Driving IGBTs with unipolar gate voltageENCN389 KB10 Feb 2014
Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 Dec 201501_02
Application Note IGBT Definition of Junction TemperatureEN84 KB09 Apr 2009
Using the NTC inside a power moduleENCN295 KB13 Jan 2010
Thermal equivalent circuit models (english version)ENDECN295 KB20 Jun 2008
Deadtime calculation for IGBT ModulesENCN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 Feb 2014
Series connection of IGBTsEN28 KB10 Feb 2014
Paralleling of IGBTsEN28 KB10 Feb 2014
Editorials
TitleSizeDateVersion
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesEN704 KB31 May 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 Nov 201501_00
The challenge of accurately analyzing thermal resistancesEN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial DrivesEN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) SystemsEN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Econo3BEN37 KB06 Jan 201403_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIMEN3.4 MB18 Mar 2014
Package Data
TitleSizeDateVersion
FS150R17N3E4 | EconoPACK™3 module | AG-ECONO3-4-1EN411 KB11 Apr 201601_00
EN/CN FS150R17N3E4
EN/DE FS150R17N3E4
EN/JA FS150R17N3E4
EN IFS75B12N3E4_B32
EN 2EDN7524G
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN DD250S65K3
EN BYM600A170DN2
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FS75R17KE3
EN IFS75B12N3E4_B32
EN FS150R17N3E4