FS50R12KT4_B11

EconoPACK™ 2 1200V sixpack IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology

ParametricFS50R12KT4_B11
ConfigurationSixpack
IC(nom) / IF(nom)50.0A
VCE(sat) (Tvj=25°C typ)1.85V
VF (Tvj=25°C typ)1.7V
HousingEconoPACK™ 2
Sales Product NameFS50R12KT4_B11
OPNFS50R12KT4B11BOSA1
Product Statusactive and preferred
Package NameAG-ECONO2-6
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Low V(CEsat)
  • T(vj op) = 150°C
  • V(CEsat) with positive Temperature Coefficient
  • Al(2)O(3) Substrate with Low Thermal Resistance
  • High Power and Thermal Cycling Capability
  • Integrated NTC temperature sensor
  • Copper Base Plate
  • Standard Housing
Benefits:
  • Compact module concept
  • Optimized development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
FS50R12KT4_B11 (german/english),EN/DE,EN/CN,EN/JA712 KB09 Dec 201303_00
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demandsEN1.3 MB27 Apr 201608_00
Product Brochure Industrial Gate Driver ICs OverviewEN613 KB27 Apr 201603_00
1EDI EiceDRIVER™ Compact 300 milEN216 KB09 May 201601_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltageENCN389 KB10 Feb 2014
Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 Feb 2014
Using the NTC inside a power moduleENCN295 KB13 Jan 2010
Application Note IGBT Definition of Junction TemperatureEN84 KB09 Apr 2009
Mounting instruction for PressFIT with forked pinsENDE675 KB04 Dec 2012
Thermal equivalent circuit models (english version)ENDECN295 KB20 Jun 2008
Deadtime calculation for IGBT ModulesENCN308 KB06 Jun 2008
Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 Feb 2014
Series connection of IGBTsEN28 KB10 Feb 2014
Paralleling of IGBTsEN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Easy & Econo Power ModulesENCN433 KB27 Apr 201608_00
PressFIT - Our established, reliable mounting technologyEN616 KB27 Apr 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 Nov 201501_00
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?EN731 KB31 Jan 2011
Reliability of PressFIT connectionsEN472 KB06 Jun 2008
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current ModulesEN141 KB07 Feb 2014
PressFIT Technology, a Solderless Method for Mounting Power ModulesEN377 KB12 Feb 2014
Improving Efficiency in AC drives: Comparison of Topologies and Device TechnologiesEN892 KB31 May 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesEN704 KB31 May 2014
The challenge of accurately analyzing thermal resistancesEN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial DrivesEN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) SystemsEN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Econo2BEN36 KB06 Jan 201403_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIMEN3.4 MB18 Mar 2014
Package Data
TitleSizeDateVersion
FS50R12KT4_B11 | EconoPACK™2 module | AG-ECONO2-6-1EN405 KB11 Apr 201601_00
EN/CN FS50R12KT4_B11
EN/DE FS50R12KT4_B11
EN/JA FS50R12KT4_B11
EN 2EDN7524G
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK180N16RR_B11
DE TDB6HK180N16RR_B11
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN TDB6HK180N16RR_B11
EN DD250S65K3
EN FP75R17N3E4
EN FS100R17N3E4_B11
EN FP75R17N3E4
EN FS100R17N3E4_B11
EN FF225R12ME4_B11
EN BYM600A170DN2
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN DDB6U104N16RR
EN IFS75B12N3E4_B32
EN FS50R12KT4_B11