数据手册：MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327 .pdf [英文Rev.2(PDF,436kB)]
{该产品的所有型号已经停产。}The MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327, MAX2329 high-performance SiGe receiver front-end ICs set a new industry standard for low noise and high linearity at a low supply current. This family integrates a variety of unique features such as an LO frequency doubler and divider, dual low-noise amplifier (LNA) gain settings, and a low-current paging mode that extends the handset standby time. The MAX2320 family includes seven ICs: four operate at both cellular and PCS frequencies, one operates at cellular frequencies, one at PCS frequencies, and one is configured as a dual PCS device (see Selector Guide). Each part includes an LNA with a high input third-order intercept point (IIP3) to minimize intermodulation and cross-modulation in the presence of large interfering signals. In low-gain mode, the LNA is bypassed to provide higher cascaded IIP3 at a lower current. For paging, a low-current, high-gain mode is provided. The CDMA mixers in cellular and PCS bands have high linearity, low noise, and differential IF outputs. The FM mixer is designed for lower current and a single-ended output. All devices come in a 20-pin TSSOP-EP package with exposed paddle and are specified for the extended temperature range (-40°C to +85°C).
产品关键特性
| 应用与使用范围
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引脚配置
芯片订购型号
| 订购型号 | 产品状态 | 封装形式 | 工作温度 | RoHS/无铅 |
| MAX2320EUP | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：否材料分析 |
| MAX2320EUP+ | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：无铅材料分析 |
| MAX2320EUP+T | 停止供货 | TSSOP；封装信息 | -40°C至+85°C | 参考数据资料 |
| MAX2320EUP-T | 停止供货 | TSSOP；20引脚封装信息 | -40°C至+85°C | 参考数据资料 |
| MAX2321EUP | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：否材料分析 |
| MAX2321EUP+ | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：无铅材料分析 |
| MAX2321EUP+T | 停止供货 | TSSOP；封装信息 | -40°C至+85°C | 参考数据资料 |
| MAX2321EUP-T | 停止供货 | TSSOP；20引脚封装信息 | -40°C至+85°C | 参考数据资料 |
| MAX2322EUP | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：否材料分析 |
| MAX2322EUP+ | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：无铅材料分析 |
| MAX2322EUP+T | 停止供货 | TSSOP；20引脚封装信息 | -40°C至+85°C | 参考数据资料 |
| MAX2322EUP-T | 停止供货 | TSSOP；20引脚封装信息 | -40°C至+85°C | 参考数据资料 |
| MAX2324EUP | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：否材料分析 |
| MAX2324EUP+ | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：无铅材料分析 |
| MAX2324EUP+T | 停止供货 | TSSOP；封装信息 | -40°C至+85°C | 参考数据资料 |
| MAX2324EUP-T | 停止供货 | TSSOP；20引脚封装信息 | -40°C至+85°C | 参考数据资料 |
| MAX2326EUP | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：否材料分析 |
| MAX2326EUP-T | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：否材料分析 |
| MAX2327EUP | 停止供货 | TSSOP-EP；20引脚；42.9mm²封装信息 | -40°C至+85°C | RoHS/无铅：否材料分析 |
| MAX2327EUP-T | 停止供货 | TSSOP；20引脚封装信息 | -40°C至+85°C | 参考数据资料 |
- MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327 : 可调、高线性度、SiGe、双频段、LNA/混频器IC MAX2320
- MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327 : 可调、高线性度、SiGe、双频段、LNA/混频器IC MAX2321
- MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327 : 可调、高线性度、SiGe、双频段、LNA/混频器IC MAX2322
- MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327 : 可调、高线性度、SiGe、双频段、LNA/混频器IC MAX2324
- MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327 : 可调、高线性度、SiGe、双频段、LNA/混频器IC MAX2326
- MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327 : 可调、高线性度、SiGe、双频段、LNA/混频器IC MAX2327
