2PA1774QM: PNP general purpose transistor

PNP general purpose transistor in a SOT883 leadless ultra small plastic package.

NPN complement: 2PC4617M series.

SOT883
Data Sheets (1)
Name/DescriptionModified Date
PNP general purpose transistor (REV 1.0) PDF (129.0 kB) 2PA1774M_SERIES19 Feb 2004
Package Information (1)
Name/DescriptionModified Date
DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT88308 Feb 2016
Packing (1)
Name/DescriptionModified Date
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_31522 Jul 2016
Reliability and Quality Information (2)
Name/DescriptionModified Date
2PA1774QM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774QM31 Jan 2015
2PA1774QM NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774QM_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
SPICE model
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
2PA1774QMSOT883Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActive2PA1774QM,315 (9340 571 43315)PB2PA1774QMAlways Pb-free153.00.711.41E911
PNP general purpose transistor 2PA1774SM
2PA1774QM NXP® Product Reliability 2PA1774QM
2PA1774QM NXP Product Quality 2PA1774QM
2PA1774QM SPICE model 2PA1774QM
DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
PMZ950UPE