74AHCU04: Hex unbuffered inverter
The 74AHCU04 is high-speed Si-gate CMOS devices and is pin compatible with low power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A.
The 74AHCU04 is a general purpose hex inverter. Each of the six inverters is a single stage.
sot108-1_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Hex unbuffered inverter (REV 4.0) PDF (139.0 kB) 74AHCU04 [English] | 07 Dec 2015 |
Application Notes (4)
| Name/Description | Modified Date |
|---|---|
| Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
| Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
| Ground and VCC Bounce of High-Speed Integrated Circuits (REV 1.0) PDF (25.0 kB) AN223 [English] | 13 Mar 2013 |
| Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English] | 13 Mar 2013 |
Package Information (3)
| Name/Description | Modified Date |
|---|---|
| plastic small outline package; 14 leads; body width 3.9 mm (REV 1.0) PDF (166.0 kB) SOT108-1 [English] | 08 Feb 2016 |
| plastic thin shrink small outline package; 14 leads; body width 4.4 mm (REV 1.0) PDF (285.0 kB) SOT402-1 [English] | 08 Feb 2016 |
| plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x... (REV 1.0) PDF (187.0 kB) SOT762-1 [English] | 08 Feb 2016 |
Packing (3)
| Name/Description | Modified Date |
|---|---|
| Standard product orientation 12NC ending 115 (REV 3.0) PDF (108.0 kB) SOT762-1_115 [English] | 09 Apr 2013 |
| SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 4.0) PDF (207.0 kB) SOT108-1_118 [English] | 08 Apr 2013 |
| TSSOP14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (217.0 kB) SOT402-1_118 [English] | 08 Apr 2013 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English] | 08 Oct 2009 |
| Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English] | 08 Oct 2009 |
| Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English] | 08 Oct 2009 |
IBIS Model
- ahcu04 IBIS model (REV 1.0) ibs AHCU04 4/7/2013
Ordering Information
| Product | Status |
|---|---|
| 74AHCU04D | Active |
| 74AHCU04BQ | Active |
| 74AHCU04PW | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHCU04BQ |  | SOT762-1 | Reel 7" Q1/T1 | Active | 74AHCU04BQ,115 (9352 855 51115) | AHU04 | 74AHCU04BQ |    | Always Pb-free | 84.9 | 6.62 | 1.51E8 | 1 | 1 | |
| 74AHCU04D | | SOT108-1 | SO-SOJ-REFLOW
SO-SOJ-WAVE SO-SOJ-REFLOW SO-SOJ-WAVE | Reel 13" Q1/T1 | Active | 74AHCU04D,118 (9352 630 42118) | 74AHCU04D | 74AHCU04D | | week 32, 2004 | 84.9 | 6.62 | 1.51E8 | 1 | 1 |
| Bulk Pack | Active | 74AHCU04D,112 (9352 630 42112) | 74AHCU04D | 74AHCU04D | | week 32, 2004 | 84.9 | 6.62 | 1.51E8 | 1 | 1 | ||||
| 74AHCU04PW |  | SOT402-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | 74AHCU04PW,118 (9352 630 43118) | AHCU04 | 74AHCU04PW | | week 10, 2005 | 84.9 | 6.62 | 1.51E8 | 1 | 1 |
| Bulk Pack | Active | 74AHCU04PW,112 (9352 630 43112) | AHCU04 | 74AHCU04PW | | week 10, 2005 | 84.9 | 6.62 | 1.51E8 | 1 | 1 |
- Hex unbuffered inverter 74AHCU04PW
- Sorting through the low voltage logic maze 74LVC_H_245A_Q100
- Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
- Ground and VCC Bounce of High-Speed Integrated Circuits 74ALVC164245DGG-Q100
- Live Insertion Aspects of Philips Logic Families 74HC_T_245_Q100
- ahcu04 IBIS model 74AHCU04PW
- plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x... 74LV164_Q100
- Standard product orientation 12NC ending 115 74LV164_Q100
- plastic small outline package; 14 leads; body width 3.9 mm 74LV164_Q100
- Footprint for reflow soldering NPIC6C596A_Q100
- Footprint for wave soldering NPIC6C596A_Q100
- SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... 74LV164_Q100
- plastic thin shrink small outline package; 14 leads; body width 4.4 mm 74LV164_Q100
- SSOP-TSSOP-VSO-WAVE LPC1114FDH28
- TSSOP14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... 74LV164_Q100
- 74LVC04A
- 74LV164
- UBA2213
- 74LV164
