74AUP1G16: Low-power buffer
The 74AUP1G16 provides a low-power, low-voltage single buffer.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Outline 3d SOT886
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Low-power buffer (REV 2.0) PDF (162.0 kB) 74AUP1G16 [English] | 07 Oct 2016 |
Package Information (3)
| Name/Description | Modified Date |
|---|---|
| plastic thin shrink small outline package; 5 leads; body width 1.25 mm (REV 1.0) PDF (223.0 kB) SOT353-1 [English] | 08 Feb 2016 |
| XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English] | 08 Feb 2016 |
| XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| TSSOP5; Reel pack; SMD, 7"; Q3 Reversed product orientation; Orderable part number ending, 125 or H; Ordering code... (REV 1.0) PDF (257.0 kB) SOT353-1_125 [English] | 15 May 2013 |
Supporting Information (4)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 [English] | 03 Jun 2013 |
| MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English] | 03 Jun 2013 |
| MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English] | 03 Jun 2013 |
IBIS Model
- 74AUP1G16 IBIS model (REV 1.0) ibs AUP1G16 10/30/2015
Ordering Information
| Product | Status |
|---|---|
| 74AUP1G16GF | Active |
| 74AUP1G16GM | Active |
| 74AUP1G16GW | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP1G16GF |  | SOT891 | Reflow_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74AUP1G16GFH (9353 075 36125) | Standard Marking | 74AUP1G16GF |    | Always Pb-free | 1 | 1 |
| 74AUP1G16GW |  | SOT353-1 | Reel 7" Q3/T4, Reverse | Active | 74AUP1G16GWH (9353 075 34125) | Standard Marking | 74AUP1G16GW | | Always Pb-free | 1 | 1 | |
| 74AUP1G16GM | | SOT886 | Reflow_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74AUP1G16GMH (9353 075 35125) | Standard Marking | 74AUP1G16GM | | Always Pb-free | 1 | 1 |
- Low-power buffer 74AUP1G16GM
- MAR_SOT353 Topmark 74LVC1G17_Q100
- MAR_SOT886 Topmark prtr5v0u2f
- MAR_SOT891 Topmark prtr5v0u2k
- 74AUP1G16 IBIS model 74AUP1G16GM
- XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm prtr5v0u2k
- plastic thin shrink small outline package; 5 leads; body width 1.25 mm 74LVC1G17_Q100
- TSSOP5; Reel pack; SMD, 7"; Q3 Reversed product orientation; Orderable part number ending, 125 or H; Ordering code... 74LVC1G17_Q100
- XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
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