74AUP1G175: Low-power D-type flip-flop with reset; positive-edge trigger (Based on PIP 74AUP1G175)

The 74AUP1G175 provides a low-power, low-voltage positive-edge triggered D-type flip-flop with individual data (D) input, clock (CP) input, master reset (MR) input, and Q output. The master reset (MR) is an asynchronous active LOW input and operates independently of the clock input. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The D input must be stable one set-up time prior to the LOW-to-HIGH clock transition, for predictable operation.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

74AUP1G175: Product Block Diagram
Outline 3d SOT886
Data Sheets (1)
Name/DescriptionModified Date
Low-power D-type flip-flop with reset; positive-edge trigger (REV 5.0) PDF (216.0 kB) 74AUP1G175 [English]03 Jul 2012
Application Notes (4)
Name/DescriptionModified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]13 Mar 2013
Pin FMEA for AUP family (REV 1.0) PDF (53.0 kB) AN11052 [English]06 May 2011
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English]30 Oct 2002
Brochures (3)
Name/DescriptionModified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]16 Feb 2015
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic (REV 1.0) PDF (1.4 MB) 75017458 [English]13 Oct 2014
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]20 May 2014
Selector Guides (2)
Name/DescriptionModified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]08 Jan 2015
Package Information (5)
Name/DescriptionModified Date
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]08 Feb 2016
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English]08 Feb 2016
Packing (6)
Name/DescriptionModified Date
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT891_132 [English]26 Aug 2014
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]23 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1115_132 [English]04 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1202_132 [English]04 Apr 2013
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT886_132 [English]28 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]20 Nov 2012
Supporting Information (7)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]03 Jun 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English]03 Jun 2013
IBIS Model
Ordering Information
ProductStatus
74AUP1G175GSActive
74AUP1G175GWActive
74AUP1G175GMActive
74AUP1G175GFActive
74AUP1G175GNActive
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
74AUP1G175GSSOT1202Reel 7" Q1/T1, Q3/T4Active74AUP1G175GS,132 (9352 928 53132)aT74AUP1G175GSAlways Pb-free11
74AUP1G175GMSOT886Reflow_Soldering_ProfileReel 7" Q1/T1Active74AUP1G175GM,115 (9352 800 04115)aT74AUP1G175GMAlways Pb-free0.03.293.04E811
Reel 7" Q1/T1, Q3/T4Active74AUP1G175GM,132 (9352 800 04132)aT74AUP1G175GMAlways Pb-free0.03.293.04E811
74AUP1G175GFSOT891Reflow_Soldering_ProfileReel 7" Q1/T1, Q3/T4Active74AUP1G175GF,132 (9352 813 34132)aT74AUP1G175GFAlways Pb-free0.03.293.04E811
74AUP1G175GWSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActive74AUP1G175GW,125 (9352 800 03125)aT74AUP1G175GWAlways Pb-free0.03.293.04E811
74AUP1G175GNSOT1115Reel 7" Q1/T1, Q3/T4Active74AUP1G175GN,132 (9352 917 28132)aT74AUP1G175GNAlways Pb-free11
Low-power D-type flip-flop with reset; positive-edge trigger 74AUP1G175GW
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
Pin FMEA for AUP family 74AUP1T34GW-Q100
MicroPak soldering information NTS0102_Q100
PicoGate Logic footprints NX3L4684
電圧レベルシフタ 74AVC16245DGG-Q100
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic 74AUP1G86GW-Q100
Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100
ロジック製品セレクションガイド... 74LVC_H_245A_Q100
Logic selection guide 2016 74LVC_H_245A_Q100
MAR_SOT1115 Topmark 74AUP1G332
MAR_SOT1202 Topmark NCX2200GS
MAR_SOT363 Topmark BSS84AKS
MAR_SOT886 Topmark prtr5v0u2f
MAR_SOT891 Topmark prtr5v0u2k
aup1g175 IBIS model 74AUP1G175GW
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm NCX2200GS
Reversed product orientation 12NC ending 132 NTS0101
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
XSON6; reel pack; standard product orientation; 12NC ending 132 NCX2200GM
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm prtr5v0u2k
XSON6; reel pack; standard product orientation; 12NC ending 132 prtr5v0u2k
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
SOT1115 74AUP1G332
Reel 7" Q1/T1, Q3/T4 74AUP1G332
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