74AUP2G16: Low-power dual buffer
The 74AUP2G16 provides two low-power, low-voltage buffers.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Outline 3d SOT886
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Low-power dual buffer (REV 2.0) PDF (161.0 kB) 74AUP2G16 [English] | 07 Oct 2016 |
Package Information (3)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
| XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English] | 08 Feb 2016 |
| XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English] | 20 Nov 2012 |
Supporting Information (5)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
| MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English] | 03 Jun 2013 |
| MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English] | 03 Jun 2013 |
IBIS Model
- 74AUP2G16 IBIS model (REV 1.0) ibs AUP2G16 10/30/2015
Ordering Information
| Product | Status |
|---|---|
| 74AUP2G16GF | Active |
| 74AUP2G16GW | Active |
| 74AUP2G16GM | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP2G16GF |  | SOT891 | Reflow_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74AUP2G16GFH (9353 075 49125) | Standard Marking | 74AUP2G16GF |    | Always Pb-free | 1 | 1 |
| 74AUP2G16GM | | SOT886 | Reflow_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74AUP2G16GMH (9353 075 48125) | Standard Marking | 74AUP2G16GM | | Always Pb-free | 1 | 1 |
| 74AUP2G16GW |  | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74AUP2G16GWH (9353 075 47125) | Standard Marking | 74AUP2G16GW | | Always Pb-free | 1 | 1 |
- Low-power dual buffer 74AUP2G16GW
- MAR_SOT363 Topmark BSS84AKS
- MAR_SOT886 Topmark prtr5v0u2f
- MAR_SOT891 Topmark prtr5v0u2k
- 74AUP2G16 IBIS model 74AUP2G16GW
- XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm prtr5v0u2k
- XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
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