BAW56M: High-speed switching diodes
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages.
SOT883
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| High-speed switching diodes (REV 6.0) PDF (370.0 kB) BAV756S_BAW56_SER | 18 Mar 2015 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BAW56M NXP Product Quality (REV 1.2) PDF (74.0 kB) BAW56M_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BAW56M NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAW56M_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- LSYMDIO_1 (REV 0.1) PDF LSYMDIO_1 5/1/1999
SPICE model
- BAW56M SPICE model (REV 1.4) prm BAW56M 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | VR [max] (V) | VR max (V) | IFSM [max] (A) | IFSM max (A) | VF [max] (mV) | VFmax (mV) | IR [max] (nA) | IR max (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr [max] (ns) | trr max (ns) | IF [max] (mA) | IF max (mA) | Cd [max] (pF) | Cd max. (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAW56M | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 90 | 90 | 5 | 5 | 1250@IF=150mA | 1250@IF=150mA | 500@VR=80V | 0.5@VR=80V | 500 | 500 | dual c.a. | 4 | 4 | 150 | 150 | 2 | 2 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAW56M | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BAW56M,315 (9340 612 71315) | S5 | BAW56M |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- High-speed switching diodes BAW56W
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAW56M NXP Product Quality BAW56M
- BAW56M NXP® Product Reliability BAW56M
- LSYMDIO_1 BAW56W
- BAW56M SPICE model BAW56M
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- PMZ950UPE
