BCP55-16: 60 V, 1 A NPN medium power transistor

NPN medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. PNP complement: BCP52.

SOT223
Data Sheets (1)
Name/DescriptionModified Date
60 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP55_BCX55_BC55PA10 Nov 2011
Application Notes (1)
Name/DescriptionModified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN1040506 Jan 2006
Brochures (1)
Name/DescriptionModified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 7501766026 May 2015
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT22308 Feb 2016
Packing (2)
Name/DescriptionModified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_11507 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_13507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
BCP55-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP55-16_NXP_PRODUCT_QUALITY31 Jan 2015
BCP55-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP55-16_NXP_PRODUCT_RELIABILITY31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
Design Support
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)ComplementPtot (mW)IC [max] (mA)PolarityIC max (mA)Ptot [max] (mW)hFE maxVCEO [max] (V)fT [min] (MHz)hFE [max]hFE [min]
BCP55-16ActiveSOT223SC-736.5 x 3.5 x 1.65BCP52-161000NPN135060180250100
60 V, 1 A NPN medium power transistors BCX55-16
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
Medium-power general-purpose transistors BSR43
BCP55-16 NXP Product Quality BCP55-16
BCP55-16 NXP® Product Reliability BCP55-16
Letter Symbols - Transistors; General PEMD16
BCP55-16 SPICE model BCP55-16
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81