BCP56-10: 80 V, 1 A NPN medium power transistor

NPN medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. PNP complement: BCP53.

SOT223
Data Sheets (1)
Name/DescriptionModified Date
80 V, 1 A NPN medium power transistors (REV 9.0) PDF (1.1 MB) BCP56_BCX56_BC56PA07 Nov 2011
Application Notes (1)
Name/DescriptionModified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN1040506 Jan 2006
Brochures (1)
Name/DescriptionModified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 7501766026 May 2015
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT22308 Feb 2016
Packing (2)
Name/DescriptionModified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_11507 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_13507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
BCP56-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP56-10_NXP_PRODUCT_QUALITY31 Jan 2015
BCP56-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP56-10_NXP_PRODUCT_RELIABILITY31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
Design Support
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)ComplementPtot (mW)IC [max] (mA)PolarityIC max (mA)Ptot [max] (mW)VCEO [max] (V)hFE maxfT [min] (MHz)hFE [max]hFE [min]
BCP56-10ActiveSOT223SC-736.5 x 3.5 x 1.65BCP53-101000NPN13508018016063
BCP56-10/RNo Longer ManufacturedSOT223SC-736.5 x 3.5 x 1.65
BCP56-10/ANo Longer ManufacturedSOT223SC-736.5 x 3.5 x 1.65
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
BCP56-10SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP56-10,135 (9339 172 50135)BCP56/10BCP56-10week 34, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCP56-10,115 (9339 172 50115)BCP56/10BCP56-10week 34, 2003153.00.711.41E911
80 V, 1 A NPN medium power transistors BCX56-16
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
Medium-power general-purpose transistors BSR43
BCP56-10 NXP Product Quality BCP56-10
BCP56-10 NXP® Product Reliability BCP56-10
Letter Symbols - Transistors; General PEMD16
BCP56-10 SPICE model BCP56-10
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81