BCP68; BC868; BC68PA: 20 V, 2 A NPN medium power transistors

NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.

SOT089
Data Sheets (1)
Name/DescriptionModified Date
20 V, 2A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP68_BC868_BC68PA [English]02 Nov 2011
Brochures (1)
Name/DescriptionModified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
Package Information (3)
Name/DescriptionModified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English]08 Feb 2016
Packing (4)
Name/DescriptionModified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English]28 Nov 2012
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
Reliability and Quality Information (12)
Name/DescriptionModified Date
BC68-25PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC68-25PA [English]31 Jan 2015
BC68-25PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC68-25PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC68PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC68PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC68PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC68PA_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC868-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC868-25_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC868-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC868-25_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC868 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC868_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC868 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC868_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP68-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP68-25_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP68-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP68-25_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP68 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP68_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP68 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP68_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE model
Ordering Information
ProductStatus
BC68PAActive
BC868Active
BCP68-25Active
BC868-25Active
BC68-25PAActive
BCP68Active
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
BC868SOT89Reel 7" Q1/T1ActiveBC868,115 (9336 787 70115)CACBC868week 28, 2003153.00.711.41E911
BC68-25PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC68-25PA,115 (9340 657 37115)ASBC68-25PAAlways Pb-free153.00.711.41E911
BC868-25SOT89Reel 7" Q1/T1ActiveBC868-25,115 (9340 053 80115)CDCBC868-25week 28, 2003153.00.711.41E911
BC68PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC68PA,115 (9340 657 36115)ARBC68PAAlways Pb-free153.00.711.41E911
BCP68-25SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP68-25,135 (9339 693 70135)BCP68/25BCP68-25week 34, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCP68-25,115 (9339 693 70115)BCP68/25BCP68-25week 34, 2003153.00.711.41E911
BCP68-25/ZLSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP68-25/ZLF (9340 707 26135)Standard MarkingBCP68-25/ZL153.00.711.41E9
Reel 7" Q1/T1ActiveBCP68-25/ZLX (9340 707 26115)Standard MarkingBCP68-25/ZL153.00.711.41E9
BCP68SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBCP68,115 (9339 686 60115)BCP68BCP68week 34, 2003153.00.711.41E911
Reel 11¼" Q1/T1 in LargePackActiveBCP68F (9339 686 60135)BCP68BCP68153.00.711.41E9
BCP68/ZLSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP68/ZLF (9340 707 17135)Standard MarkingBCP68/ZL153.00.711.41E9
Reel 7" Q1/T1ActiveBCP68/ZLX (9340 707 17115)Standard MarkingBCP68/ZL153.00.711.41E9
20 V, 2A NPN medium power transistors BCP68-25
Medium-power general-purpose transistors BSR43
BC68-25PA NXP® Product Reliability BC68-25PA
BC68-25PA NXP Product Quality BC68-25PA
BC68PA NXP Product Quality BC68PA
BC68PA NXP® Product Reliability BC68PA
BC868-25 NXP Product Quality BC868-25
BC868-25 NXP® Product Reliability BC868-25
BC868 NXP Product Quality BC868
BC868 NXP® Product Reliability BC868
BCP68-25 NXP Product Quality BCP68-25
BCP68-25 NXP® Product Reliability BCP68-25
BCP68 NXP Product Quality BCP68
BCP68 NXP® Product Reliability BCP68
Letter Symbols - Transistors; General PEMD16
Power Derating Curves for SMDs; General BST62
BC68-25PA SPICE model BCP68_BC868_BC68PA
BC68PA SPICE model BCP68_BC868_BC68PA
BC868 SPICE model BCP68_BC868_BC68PA
BC868-25 SPICE model BCP68_BC868_BC68PA
BCP68 SPICE model BCP68_BC868_BC68PA
BCP68-25 SPICE model BCP68-25
plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BFU590Q
PTVSXU1UPA_SERIES
BLT81