BGS8H2UK: SiGe:C low-noise amplifier MMIC with bypass switch for LTE

The BGS8H2UK is a Low-Noise Amplifier (LNA) with bypass switch for LTE receiver applications, available in a Wafer Level Chip Scale Package (WLCSP). This product is only used in an overmolded module.

The BGS8H2UK delivers system-optimized gain for both primary and diversity applications where sensitivity improvement is required. The high linearity of this low noise device ensures the required receive sensitivity independent of cellular transmit power level in Frequency Division Duplex (FDD) systems. To lower power consumption the receive signal strength is sufficient. The BGS8H2UK can be switched off to operate in bypass mode at a 1 μA current. The BGS8H2UK requires only one external matching inductor.

The BGS8H2UK is optimized for 2300 MHz to 2690 MHz.

sot1445-1_3d

Moisture sensitivity level 1

Application Notes (1)
Name/DescriptionModified Date
BGS8H2UK LTE LNA with bypass switch evaluation board (REV 1.0) PDF (819.0 kB) AN1168112 Oct 2016
Package Information (1)
Name/DescriptionModified Date
wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm (REV 1.1) PDF (218.0 kB) SOT1445-112 Jul 2016
Packing (1)
Name/DescriptionModified Date
WLSCP6; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,019 or... (REV 1.0) PDF (201.0 kB) SOT1445-1_01928 Aug 2015
S-Parameters
Ordering Information
ProductStatusPackage version@VCC [min] (V)@VCC [max] (V)@ICC [typ] (mA)Gp [typ] (dB)NF [typ] (dB)Pi(1dB) [min] (dBm)Pi(1dB) [typ] (dBm)IP3i [min] (dBm)IP3i [typ] (dBm)@VCC (V)@f (MHz)
BGS8H2UKActiveSOT1445-11.53.1130.95-2
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
BGS8H2UKSOT1445-1Reel 13" Q1/T1 in DrypackActiveBGS8H2UKAZ (9340 695 48019)Standard MarkingBGS8H2UKAlways Pb-free11
BGS8H2UK LTE LNA with bypass switch evaluation board BGS8H2UK
BGS8H2UK gain mode Spar and Noise BGS8H2UK
wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm BGU8103UK
WLSCP6; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,019 or... BGU8103UK