BGS8M2UK: SiGe:C Low Noise Amplifier MMIC with bypass switch for LTE

The BGS8M2UK is a Low Noise Amplifier (LNA) with bypass switch for LTE receiver applications, available in a Wafer-Level Chip-Scale Package (WLCSP). This product is only to be used in an overmolded module.

The BGS8M2UK delivers system-optimized gain for both primary and diversity applications where sensitivity improvement is required. The high linearity of this low noise device ensures the required receive sensitivity independent of cellular transmit power level in Frequency Division Duplex (FDD) systems. When receive signal strength is sufficient, the BGS8M2UK can be switched off to operate in bypass mode at a 1 A current, to lower power consumption. The BGS8M2UK requires only one external matching inductor.

The BGS8M2UK is optimized for 1805 MHz to 2200 MHz.

sot1445-1_3d
Application Notes (1)
Name/DescriptionModified Date
BGS8M2UK LTE LNA with bypass switch evaluation board (REV 1.0) PDF (852.0 kB) AN1168013 Oct 2016
Package Information (1)
Name/DescriptionModified Date
wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm (REV 1.1) PDF (218.0 kB) SOT1445-112 Jul 2016
Packing (1)
Name/DescriptionModified Date
WLSCP6; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,019 or... (REV 1.0) PDF (201.0 kB) SOT1445-1_01928 Aug 2015
S-Parameters
Ordering Information
ProductStatusPackage version@VCC [min] (V)@VCC [max] (V)@ICC [typ] (mA)Gp [typ] (dB)NF [typ] (dB)Pi(1dB) [min] (dBm)Pi(1dB) [typ] (dBm)IP3i [min] (dBm)IP3i [typ] (dBm)@VCC (V)@f (MHz)
BGS8M2UKActiveSOT1445-11.53.115.40.75-3.5
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
BGS8M2UKSOT1445-1Reel 13" Q1/T1 in DrypackActiveBGS8M2UKAZ (9340 695 51019)Standard MarkingBGS8M2UKAlways Pb-free11
BGS8M2UK LTE LNA with bypass switch evaluation board BGS8M2UK
BGS8M2UK gain mode S-par and Noise BGS8M2UK
wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm BGU8103UK
WLSCP6; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,019 or... BGU8103UK