BGU8004: SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo and Compass

The BGU8004 is a Low Noise Amplifier (LNA) for GNSS receiver applications. It comes as extremely small and thin Wafer Level Chip Scale Package (WLCSP). The BGU8004 requires one external matching inductor.

The BGU8004 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption with optimised performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 17 dB gain at a noise figure of 0.60 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity.

wlcsp6_bgu8004_3d
Data Sheets (1)
Name/DescriptionModified Date
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo and Compass (REV 1.0) PDF (393.0 kB) BGU800431 Jan 2014
Application Notes (1)
Name/DescriptionModified Date
BGU8004 GNSS LNA evaluation board (REV 2.0) PDF (501.0 kB) AN1136912 Feb 2014
Package Information (1)
Name/DescriptionModified Date
wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm (REV 1.0) PDF (290.0 kB) OL-BGU800408 Feb 2016
S-Parameters
Ordering Information
ProductStatusPackage version@VCC [min] (V)@VCC [max] (V)@ICC [typ] (mA)Gp [typ] (dB)NF [typ] (dB)Pi(1dB) [min] (dBm)Pi(1dB) [typ] (dBm)IP3i [min] (dBm)IP3i [typ] (dBm)@VCC (V)@f (MHz)
BGU8004ActiveOL-BGU80041.53.1190.6-1041.81575
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
BGU8004OL-BGU8004Reel 7" Q1/T1ActiveBGU8004X (9340 678 31115)Standard MarkingBGU8004Always Pb-free11
Reel 13" Q2/T3 in DrypackActiveBGU8004Z (9340 678 31044)Standard MarkingBGU8004Always Pb-free11
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo and Compass BGU8004
BGU8004 GNSS LNA evaluation board BGU8004
S-parameter BGU8004 BGU8004
wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm BGU8004
BGU8004