LPC11D14FBD100: Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM® Cortex®-M0+/M0 Cores

The LPC11D14 is a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11D14 is a dual-chip module consisting of a LPC1114 single-chip microcontroller combined with a PCF8576D Universal LCD driver in a low-cost 100-pin package. The LCD driver provides 40 segments and supports from one to four backplanes. Display overhead is minimized by an on-chip display RAM with auto-increment addressing.

LPC11D14FBD100: Product Block Diagram

Outline 3d SOT407-1

Data Sheets (1)

Name/Description	Modified Date
32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 8 kB SRAM; 40 segment x 4 LCD driver (REV 2.0) PDF (546.0 kB) LPC11D14	23 Jul 2012

Errata (1)

Name/Description	Modified Date
Errata sheet LPC11D14 (REV 2.0) PDF (37.0 kB) ES_LPC11D14	28 Jan 2013

Application Notes (6)

Name/Description	Modified Date
AES encryption and decryption software on LPC microcontrollers (REV 1.1) ZIP (174.0 kB) AN11241	17 Mar 2014
NXP® LPC Cortex-M0 IEC60335 Class B library (REV 1.1) ZIP (2.5 MB) AN11208	24 Jan 2014
I2C secondary boot loader (REV 1.0) ZIP (661.0 kB) AN11258	09 Aug 2013
SPI secondary boot loader (REV 1.0) ZIP (638.0 kB) AN11257	22 Jul 2013
How to implement the PMBus software stack (REV 1.0) ZIP (1.1 MB) AN11318	22 Jul 2013
UUencoding for UART ISP (REV 1.0) PDF (139.0 kB) AN11229	06 Jul 2012

Users Guides (2)

Name/Description	Modified Date
UM10398; LPC111x-LPC11Cxx简体中文用户手册 (REV 5.0) PDF (2.6 MB) LPC111X_11CXX_UM_SIMP_CHN_1	16 Sep 2016
LPC111x/LPC11Cxx User manual (REV 12.3) PDF (3.8 MB) UM10398	11 Jun 2014

Package Information (1)

Name/Description	Modified Date
plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm (REV 1.0) PDF (687.0 kB) SOT407-1	08 Feb 2016

Supporting Information (2)

Name/Description	Modified Date
ADC design guidelines (REV 1.0) PDF (145.0 kB) TN00009	09 May 2014
Footprint for wave soldering (REV 1.0) PDF (11.0 kB) HTQFP-HLQFP-LQFP-MSQFP-WAVE	08 Oct 2009

Ordering Information

Product	Status	Core	Clock speed [max] (MHz)	DMIPS	Flash (kB)	RAM (kB)	EEPROM (kB)	GPIO	Ethernet	USB	USB (speed)	USB (type)	LCD	CAN	UART	I²C	SPI	I²S	ADC sample rate	ADC channels	ADC (bits)	Comparators	Timers	DAC (bits)	Timer (bits)	SCTimer / PWM	RTC	PWM	Package name	Temperature range	Temperature sensor	IOH	Supply voltage [min] (V)	Supply voltage [max] (V)	Product category	Demoboard
LPC11D14FBD100/302	Active	Cortex-M0	50		32	8		42							1	1	2			8	10		4		16; 32	1		11	LQFP100	-40 °C to +85 °C			1.8	3.6		OM13023

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	MSL	MSL LF
LPC11D14FBD100/302		SOT407-1	HTQFP-HLQFP-LQFP-MSQFP-WAVE	Tray, Bakeable, Single in Drypack	Active	LPC11D14FBD100/302 (9352 965 91551)	Standard Marking	LPC11D14FBD100/302		Always Pb-free	3	3