LPC18S30FBD144: 32-bit ARM Cortex-M3 flashless MCU with security features; 200 kB SRAM; Ethernet, two HS USB, EMC

The LPC18S30FBD144 is a ARM Cortex-M3 based microcontroller with security features for embedded applications. The ARM Cortex-M3 is a next generation core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration.

The LPC18S30FBD144 operates at CPU frequencies of up to 180 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching.

The LPC18S30FBD144 includes 200 kB of on-chip SRAM, security features with AES engine, a quad SPI Flash Interface (SPIFI), a State Configurable Timer/PWM (SCTimer/PWM) subsystem, two High-speed USB controllers, Ethernet, an external memory controller, and multiple digital and analog peripherals.

sot486-1_3d

Data Sheets (1)

Name/Description	Modified Date
32-bit ARM Cortex-M3 flashless MCU with security features; up to 200 kB SRAM; Ethernet, two HS USB, LCD, EMC, AES (REV 1.2) PDF (2.8 MB) LPC18S50_30_10	08 Mar 2016

Errata (1)

Name/Description	Modified Date
Errata sheet LPC18S50, LPC18S30, LPC18S10 (REV 1.6) PDF (328.0 kB) ES_LPC18SX0	02 May 2016

Application Notes (5)

Name/Description	Modified Date
LPC1800 (with Flashless) Low Power Modes and Wake-up Times (REV 1.0) ZIP (1.5 MB) AN11853	15 Aug 2016
LPC18S/43S00, LPC18/4300 Random Number Generator (REV 1.0) ZIP (99.0 MB) AN11643	08 Aug 2016
LPC18xx Secondary USB Host bootloader (REV 1.0) ZIP (3.6 MB) AN11651	06 Mar 2015
LPC18Sxx/43Sxx Secure Boot from QSPI Device (REV 1.1) ZIP (998.0 kB) AN11648	26 Feb 2015
LPC18Sxx/43Sxx Hardware Versus Software AES Benchmark (REV 1.0) ZIP (9.7 MB) AN11649	23 Feb 2015

Users Guides (1)

Name/Description	Modified Date
LPC18xx ARM Cortex-M3 microcontroller (REV 2.8) PDF (9.2 MB) UM10430	15 Dec 2015

Fact Sheets (1)

Name/Description	Modified Date
LPC18Sxx Series of MCUs - Fact Sheet (REV 1.0) PDF (195.0 kB) LPC18SXXLF	28 Jul 2016

Package Information (1)

Name/Description	Modified Date
plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm (REV 1.0) PDF (830.0 kB) SOT486-1	08 Feb 2016

Reports or Presentations (1)

Name/Description	Modified Date
Driving LPC1700/LPC1800/LPC4300 with EPSON Crystals (REV 1.1) PDF (209.0 kB) R_10076	27 Nov 2015

Supporting Information (1)

Name/Description	Modified Date
Footprint for wave soldering (REV 1.0) PDF (11.0 kB) HTQFP-HLQFP-LQFP-MSQFP-WAVE	08 Oct 2009

Ordering Information

Product	Status	Core	Clock speed [max] (MHz)	DMIPS	Flash (kB)	RAM (kB)	EEPROM (kB)	Security	GPIO	Ethernet	USB	USB (speed)	USB (type)	LCD	CAN	UART	I²C	SPI	I²S	ADC channels	ADC (bits)	DAC (bits)	ADC sample rate	Timers	Comparators	Timer (bits)	SCTimer / PWM	PWM	Package name	RTC	Temperature range	Supply voltage [min] (V)	Supply voltage [max] (V)	QEI	Demoboard	Temperature sensor	IOH	Product category
LPC18S30FBD144	Active	Cortex-M3	180	225	0	200	0	Y	83	1	2	HS (2x)	host/device	0	2	4	2	22		8	10	10	400 ksps	4	0	32	1	6	LQFP144		-40 °C to +85 °C	2.4	3.6			0	N	140-LPC1800-

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	MSL	MSL LF
LPC18S30FBD144		SOT486-1	HTQFP-HLQFP-LQFP-MSQFP-WAVE	Tray, Bakeable, Single in Drypack	Active	LPC18S30FBD144E (9353 059 02551)	Standard Marking	LPC18S30FBD144		Always Pb-free	NA	3