MC33662: LIN 2.1 / SAEJ2602-2, LIN Physical Layer

The NXP® MC33662 is a physical layer component dedicated to automotive LIN sub-bus applications.

NXP® MC33662 Internal Block Diagram
NXP® MC33662 Product Image
特性
  • Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC, and handles 40 V during Load Dump
  • Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and SAEJ2602-2
  • Active bus wave shaping, offering excellent radiated emission performance
  • Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, 20 kV on the WAKE pin, and 25 kV on the VSUP pin
  • Very high immunity against electromagnetic interference
  • Low standby current in Sleep mode
  • Over-temperature protection
  • Local and remote Wake-up capability reported by the RXD pin
  • Fast baud rate selection reported by RXD pin
  • 5.0 V and 3.3 V compatible digital inputs without any required external components
Recommended Documentation (3)
Name/DescriptionTypeModified Date
MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet (REV 7.0) PDF (585.6 kB) MC33662Data Sheets30 Jan 2014
MC33662FS, LIN 2.1 / SAEJ2602-2, LIN Physical Layer (REV 3.0) PDF (125.5 kB) MC33662FSFact Sheets09 Sep 2011
AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note (REV 3.0) PDF (3.3 MB) AN2409Application Notes21 Oct 2014
Data Sheets (1)
Name/DescriptionModified Date
MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet (REV 7.0) PDF (585.6 kB) MC3366230 Jan 2014
Application Notes (1)
Name/DescriptionModified Date
AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note (REV 3.0) PDF (3.3 MB) AN240921 Oct 2014
Users Guides (1)
Name/DescriptionModified Date
KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide (REV 1.0) PDF (1.0 MB) KT33662UG31 Aug 2011
Fact Sheets (1)
Name/DescriptionModified Date
MC33662FS, LIN 2.1 / SAEJ2602-2, LIN Physical Layer (REV 3.0) PDF (125.5 kB) MC33662FS09 Sep 2011
Ordering Information
ProductStatusStatusDevice FunctionBudgetary Price excluding tax(US$)Package Type and Termination CountCommunication ProtocolData Rate (Min) (kbps)Data Rate (Max) (kbps)Data Rate (Spec) (kbps)Load Supply Voltage (Min) (V)Load Supply Voltage (Max) (V)Supply Voltage (Min-Max) (V)Interface and Input ControlAmbient Operating Temperature (Min-Max) (°C)ProtectionDiagnosticsAdditional Features-AnalogRoHS
MC33662BLEFR2ActiveComm Transceivers1K @ US$0.34SOIC 8LIN201007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662BSEFActiveComm Transceivers1K @ US$0.34SOIC 8LIN201007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662BJEFActiveComm Transceivers1K @ US$0.34SOIC 8LIN10.41007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662BLEFActiveComm Transceivers1K @ US$0.34SOIC 8LIN201007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662BSEFR2ActiveComm Transceivers1K @ US$0.34SOIC 8LIN201007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662BJEFR2ActiveComm Transceivers1K @ US$0.34SOIC 8LIN10.41007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662JEFR2Not Recommended for New DesignComm Transceivers1K @ US$0.34SOIC 8LIN10.41007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662LEFR2Not Recommended for New DesignComm Transceivers1K @ US$0.34SOIC 8LIN201007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662LEFNot Recommended for New DesignComm Transceivers1K @ US$0.34SOIC 8LIN201007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662SEFNot Recommended for New DesignComm Transceivers1K @ US$0.34SOIC 8LIN201007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662SEFR2Not Recommended for New DesignComm Transceivers1K @ US$0.34SOIC 8LIN201007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
MC33662JEFNot Recommended for New DesignComm Transceivers1K @ US$0.34SOIC 8LIN10.41007 to 18-40 to 125OvertemperatureSleep Mode[object Object]
Package Information
Package DescriptionOutline VersionPackingProduct StatusPart NumberChemical ContentRoHS / Pb FreeChina RoHS LookupMSLPPT (°C)
SOICN 8 3.9*4.9*1.7598ASB42564BMPQ - 98 RAILPOQ - 2450 BOXActiveMC33662BJEFMC33662BJEF.pdf3260
MPQ - 2500 REELPOQ - 2500 BOXActiveMC33662BJEFR2MC33662BJEFR2.pdf3260
MPQ - 98 RAILPOQ - 2450 BOXActiveMC33662BLEFMC33662BLEF.pdf3260
MPQ - 2500 REELPOQ - 2500 BOXActiveMC33662BLEFR2MC33662BLEFR2.pdf3260
MPQ - 98 RAILPOQ - 2450 BOXActiveMC33662BSEFMC33662BSEF.pdf3260
MPQ - 2500 REELPOQ - 2500 BOXActiveMC33662BSEFR2MC33662BSEFR2.pdf3260
MPQ - 98 RAILPOQ - 2450 BOXNot Recommended for New DesignMC33662JEFMC33662JEF.pdf3260
MPQ - 2500 REELPOQ - 2500 BOXNot Recommended for New DesignMC33662JEFR2MC33662JEFR2.pdf3260
MPQ - 98 RAILPOQ - 2450 BOXNot Recommended for New DesignMC33662LEFMC33662LEF.pdf3260
MPQ - 2500 REELPOQ - 2500 BOXNot Recommended for New DesignMC33662LEFR2MC33662LEFR2.pdf3260
MPQ - 98 RAILPOQ - 2450 BOXNot Recommended for New DesignMC33662SEFMC33662SEF.pdf3260
MPQ - 2500 REELPOQ - 2500 BOXNot Recommended for New DesignMC33662SEFR2MC33662SEFR2.pdf3260
MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet MC33662
AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note mc33797
KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide MC33662
MC33662FS, LIN 2.1 / SAEJ2602-2, LIN Physical Layer MC33662
评估套件 - MC33662L,LIN2.1/SAEJ2602-2, LIN物理层 MC33662
评估套件 - MC33662J,LIN2.1/SAEJ2602-2,LIN物理层 MC33662
98ASB42564B S08SH
MC33662BJEF.pdf MC33662
MC33662BJEFR2.pdf MC33662
MC33662BLEF.pdf MC33662
MC33662BLEFR2.pdf MC33662
MC33662BSEF.pdf MC33662
MC33662BSEFR2.pdf MC33662
MC33662JEF.pdf MC33662
MC33662JEFR2.pdf MC33662
MC33662LEF.pdf MC33662
MC33662LEFR2.pdf MC33662
MC33662SEF.pdf MC33662
MC33662SEFR2.pdf MC33662