PBHV9560Z: 600 V, 0.5 A PNP high-voltage low VCEsat (BISS) transistor
PNP high-voltage low VCEsat Breakthrough In Small Signal (BISS) transistor in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.
NPN complement: PBHV8560Z
SOT223
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 600 V, 0.5 A PNP high-voltage low VCEsat (BISS) transistor (REV 2.0) PDF (214.0 kB) PBHV9560Z [English] | 12 Aug 2014 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBHV9560Z NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBHV9560Z_1 [English] | 31 Jan 2015 |
| PBHV9560Z NXP Product Quality (REV 1.2) PDF (74.0 kB) PBHV9560Z_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PBHV9560Z SPICE model (REV 1.0) TXT PBHV9560Z_1_2 11/21/2014
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | VCEsat [max] (mV) | RCEsat@IC [max]; IC/IB =10 [typ] (mΩ) | hFE [min] | fT [typ] (MHz) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBHV9560Z | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 650 | -600 | -0.5 | -250 | 70 | 38 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBHV9560Z | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PBHV9560ZX (9340 685 91115) | HV956Z | PBHV9560Z |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- PBHV9560Z NXP® Product Reliability PBHV9560Z
- PBHV9560Z NXP Product Quality PBHV9560Z
- PBHV9560Z SPICE model PBHV9560Z
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BLT81
